IP Library Granted Patent US 7,402,803
Granted Patent B1
US 7,402,803 · App. 11/448,450 · Granted Jul 22, 2008

Pixel architecture for thermal imaging system

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Quick Facts
Patent No.
US 7,402,803
App. No.
11/448,450
Granted
Jul 22, 2008
Kind
B1
Abstract

A thermally tunable pixel element includes a substrate; a thermally tunable filter island; a thermal absorption structure in direct thermal contact with and extending beyond the thermally tunable filter island; and a thermal isolation structure providing a thermally isolating path between the thermal absorption structure and the substrate.

Claims (21)

1. A structure comprising:

a substrate;

a plurality of thermally tunable filter islands;

a thermally isolating trench between each filter island of the plurality of filter islands;

a thermal absorption structure in direct thermal contact with and extending beyond one of the thermally tunable filter islands; and

a thermal isolation structure providing a thermally isolating path between the thermal absorption structure and the substrate.

2. The structure of claim 1 , wherein the thermal absorption structure supports the said one of the filter islands from below.

3. The structure of claim 1 , wherein the thermal absorption structure supports the said one of the filter islands from above.

4. The structure of claim 1 , wherein the said one of the filter islands has a smaller area than the thermal absorption structure.

5. The structure of claim 1 , wherein the thermal isolation structure comprises a support arm for the said one of the thermally tunable filter islands and the thermal absorption structure.

6. The structure of claim 1 , wherein the thermal isolation structure comprises a plurality of support arms for the said one of the thermally tunable filter island and thermal absorption structure.

7. The structure of claim 1 , wherein the thermal isolation structure comprises a patterned portion of the thermal absorption structure.

8. The structure of claim 1 , wherein the thermal isolation structure comprises a thermally isolating post.

9. The structure of claim 1 , further including a space between the substrate and the thermal absorption structure.

10. The structure of claim 9 , wherein the space has a thickness that is about ¼ of a thermal wavelength of interest.

11. The structure of claim 10 , further comprising a patterned reflective layer that reflects at least the thermal wavelength of interest.

12. The structure of claim 1 , further comprising a patterned absorbing layer, at least a portion of which absorbs light irradiating the pixel element.

13. The structure of claim 12 , wherein the patterned absorbing layer comprises an aperture that transmits light irradiating the pixel element.

14. The structure of claim 1 , wherein the thermally tunable filter island comprises a thermally tunable thin film interference filter.

15. The structure of claim 1 , wherein the thermal absorbing structure comprises silicon dioxide, silicon nitride, or a mixture thereof.

16. The structure of claim 1 , wherein the thermal absorbing structure comprises a thin metal film.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Oct 1, 2021
From: TECHNOLOGY VENTURE PARTNERS, L.P.; TVP AFFILIATES FUND, L.P.; CADOGAN, WILLIAM J.
To: REDSHIFT BIOANALYTICS, INC.
Reel/Frame 057666/0784 →
SECURITY AGREEMENT Recorded Aug 31, 2011
From: REDSHIFT SYSTEMS CORPORATION
To: TECHNOLOGY VENTURE PARTNERS, L.P.; TVP AFFILIATES FUND, L.P.; CADOGAN, WILLIAM J.
Reel/Frame 026834/0778 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2006
From: WAGNER, MATTHIAS; WU, SHUYUN; MA, EUGENE Y.
To: REDSHIFT SYSTEMS CORPORATION
Reel/Frame 018002/0171 →