Electronic device, display apparatus, flexible circuit board and fabrication method thereof
A flexible circuit board including a base film, a first conductive layer, a second conductive layer and an adhesive layer is provided. The base film has a first surface and a second surface. The first conductive layer is disposed on the first surface of the base film directly and has a thermal bonding region. The second conductive layer is disposed above the second surface of the base film. The adhesive layer is adhered between the second conductive layer and the base film and does not overlap the thermal bonding region. Because the flexible circuit board can bear the operation temperature of the thermal bonding process, therefore, the reliability of electrical connection between flexible circuit board and PCB can be improved. Besides, only the first conductive layer is formed by sputtering, and therefore the production cost of the present invention can be reduced compared with the prior art.
1 . A flexible circuit board, comprising:
a base film having a first surface and a second surface;
a first conductive layer disposed on the first surface of the base film directly and having a thermal bonding region;
a second conductive layer disposed above the second surface of the base film; and
an adhesive layer adhered between the second conductive layer and the base film, wherein the adhesive layer does not overlap the thermal bonding region.
2 . The flexible circuit board according to claim 1 , further comprising a first passivation layer disposed on the first conductive layer, wherein the first passivation layer does not overlap the thermal bonding region.
3 . The flexible circuit board according to claim 1 , further comprising a second passivation layer disposed on the second conductive layer.
4 . The flexible circuit board according to claim 1 , further comprising at least one conductive plug formed in the base film and the adhesive layer for electrically connecting the first conductive layer and the second conductive layer.
5 . The flexible circuit board according to claim 1 , wherein the material of the base film comprises polyimide, polyester or polyethylene terephthalate resin (PET).
6 . The flexible circuit board according to claim 1 , wherein the first conductive layer is a copper foil.
7 . The flexible circuit board according to claim 1 , wherein the second conductive layer is a copper foil.
8 . A display apparatus, comprising:
a display panel;
a printed circuit board, disposed at one side of the display panel; and
at least one flexible circuit board as recited in claim 1 , for electrically connecting the display panel and the printed circuit board.
9 . An electronic device, comprising:
a display apparatus, as recited in claim 8 ; and
an input apparatus, suitable for providing the display apparatus with information, such that an image is displayed by the display apparatus.
10 . A method for fabricating a flexible circuit board, comprising the following steps:
providing a base film with a first conductive layer disposed thereon, wherein the first conductive layer has a thermal bonding region;
providing a second conductive layer with an adhesive layer disposed thereon; and
bonding the base film and the second conductive layer together with the adhesive layer disposed therebetween, wherein the adhesive layer does not overlap the thermal bonding region.
11 . The method for fabricating a flexible circuit board according to claim 10 , further comprising a step of forming a conductive plug in the base film for electrically connecting the first conductive layer and the second conductive layer.
12 . The method for fabricating a flexible circuit board according to claim 10 , further comprising a step of forming a first passivation layer on the first conductive layer before bonding the base film and the second conductive layer together.
13 . The method for fabricating a flexible circuit board according to claim 10 , wherein the second conductive layer is provided on a passivation layer, and the second conductive layer is disposed between the passivation layer and the adhesive layer.
14 . The method for fabricating a flexible circuit board according to claim 10 , wherein the first conductive layer disposed on the base film is formed by deposition or lamination.
15 . The method for fabricating a flexible circuit board according to claim 14 , wherein the first conductive layer disposed on the base film is formed by sputtering.