IP Library Granted Patent US 8,117,581
Granted Patent B1
US 8,117,581 · App. 11/449,057 · Granted Feb 14, 2012

Self-propelling decoupling capacitor design for flexible area decoupling capacitor fill design flow

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Quick Facts
Patent No.
US 8,117,581
App. No.
11/449,057
Granted
Feb 14, 2012
Kind
B1
Abstract

A method of filling dcaps in an integrated circuit includes identifying a set of dcap-eligible areas of the integrated circuit for areas large enough to accommodate at least one dcap cell having a selected size smaller than a default size. The dcap cell includes at least one built-in power track. A set of dcap cells are filled in the identified set of dcap-eligible areas. Each of the built-in power tracks included in the set of dcap cells is connected to a corresponding power grid. An integrated circuit including a power grid channel formed between at least two power grids and a plurality of dcaps including a first dcap included in a dcap cell, the dcap cell including built-in power tracks, each one of the built-in power tracks being connected to a corresponding one of the at least two power grids is also described.

Claims (11)

1. An integrated circuit comprising:

a power grid channel formed between at least two power grids;

a plurality of dcaps including a first dcap included in a dcap cell, the dcap cell including built-in power tracks, each one of the built-in power tracks being connected to a corresponding one of the at least two power grids, wherein the built-in power tracks are formed in an adjacent metal layer to the metal layer including the power grids, and wherein the built-in power tracks are formed in an m1 metal layer of the integrated circuit and the power grids are formed in an m2 metal layer of the integrated circuit; and

a plurality of dcap-eligible areas, each of the dcap-eligible areas including a plurality of rows, each one of the plurality of rows having a height substantially equal to a height of the dcap cell and wherein each one of the plurality of rows is divided into a plurality of equal shaped areas having a shape substantially equal to a shape of the dcap cell, wherein at least a portion of the plurality of dcaps are located within the power grid channel.

2. The integrated circuit of claim 1 , wherein at least a portion of the plurality of dcaps are not located within the power grid channel.

3. The integrated circuit of claim 1 , wherein the built-in power tracks have a pitch different than a pitch of the power grids.

4. The integrated circuit of claim 3 , wherein the built-in power tracks have a pitch less than the pitch of the power grids.

5. The integrated circuit of claim 1 , wherein two or more of the plurality of dcaps are butted together in at least one of a horizontal array or a vertical array.

6. The integrated circuit of claim 1 , wherein the dcap cells include dcaps having a shape other than a default shape.

7. The integrated circuit of claim 1 , wherein the corresponding power grids include at least one Vdd power grid and at least one Vss power grid.

8. The integrated circuit of claim 1 , wherein the built-in power tracks included in the set of dcap cells are coupled to more than one corresponding power grids.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037311/0150 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2006
From: LI, MU-JING
To: SUN MICROSYSTEMS, INC.
Reel/Frame 017985/0688 →