IP Library Granted Patent US 7,465,405
Granted Patent B2
US 7,465,405 · App. 11/450,431 · Granted Dec 16, 2008

Method of fabricating printheads having multiple nozzle assemblies

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Quick Facts
Patent No.
US 7,465,405
App. No.
11/450,431
Granted
Dec 16, 2008
Kind
B2
Abstract

A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate includes the step of applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess. The substrate is then segmented.

Claims (10)

1. A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate, the method comprising the steps of:

applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess;

segmenting the substrate into discrete parts;

bonding an adhesive layer to a back side of the substrate, the adhesive layer being curable in the presence of ultraviolet light;

segmenting the guard into discrete parts corresponding to the discrete parts of the substrate thereby forming individual printheads; and

selectively exposing the adhesive layer to ultraviolet light allowing removal of individual printheads.

2. A method as claimed in claim 1 , further including the step of applying a handling layer to the adhesive layer so that the adhesive layer is located between the handling layer and the substrate.

3. A method as claimed in claim 1 , including the further step of etching a plurality of ink ejection channels in the guard so that each ink ejection channel is in register with a respective nozzle assembly.

4. A method as claimed in claim 1 , wherein the step of segmenting the substrate comprises the step of etching the substrate from the back side of the substrate prior to bonding the adhesive layer to the back side of the substrate.

5. A method as claimed in claim 4 , comprising the further step of etching a plurality of ink supply channels in the back side of the substrate prior to bonding the adhesive layer to the back side of the substrate so that each nozzle assembly is in fluid communication with a respective ink supply channel.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028569/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2006
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 017967/0346 →