Inkjet nozzle assembly incorporating actuator mechanisms arranged to effect rectilinear movement of a working member
View Patent ↗An inkjet nozzle assembly includes a substrate. A drive circuitry layer is positioned on the substrate An inkjet nozzle is mounted to the substrate and defines an ink chamber. The nozzle includes a fixed portion that extends from the substrate, and a movable portion that defines an ink ejection port and which is displaceable with respect to the fixed portion. At least two actuating arrangements are operatively positioned with respect to the movable portion and configured to receive an electrical drive signal from the drive circuitry layer and to move the movable portion with respect to the fixed portion so as to vary the volume of the ink chamber. The actuating arrangements are positioned to exert a resultant, substantially vertical force on the movable portion with respect to the substrate.
1. An inkjet nozzle assembly comprising:
a substrate;
a drive circuitry layer positioned on the substrate;
an inkjet nozzle mounted to the substrate and defining an ink chamber; the nozzle comprising a fixed portion extending from the substrate, and a movable portion defining an ink ejection port and which is displaceable with respect to the fixed portion; and
at least two actuating arrangements operatively positioned with respect to the movable portion and configured to receive an electrical drive signal from the drive circuitry layer and to move the movable portion with respect to the fixed portion so as to vary the volume of the ink chamber, the actuating arrangements being positioned to exert a resultant, substantially vertical force on the movable portion with respect to the substrate.
2. An inkjet nozzle assembly as claimed in claim 1 , wherein the actuating arrangements each comprise at least one electrical actuator arranged to move the movable portion with respect to the fixed portion.
3. An inkjet nozzle assembly as claimed in claim 2 , wherein the substrate includes a silicon wafer layer, and the drive circuitry layer is in the form of a CMOS drive circuitry layer positioned on the silicon wafer layer and configured to drive the at least one electrical actuator.
4. An inkjet nozzle assembly as claimed in claim 3 , wherein the substrate further includes an ink passivation layer positioned on the CMOS drive circuitry layer.
5. An inkjet nozzle assembly as claimed in claim 2 , wherein a pair of electrical actuators is located on opposite sides of the nozzle.
6. An inkjet nozzle assembly as claimed in claim 5 , wherein each electrical actuator includes a fixed support mounted to the substrate, and a bendable actuator bridge extending between the fixed support and the movable portion, whereby the bendable actuator bridge can be bent so as to impart the movement of the movable portion with respect to the fixed portion.
7. An inkjet nozzle assembly as claimed in claim 6 , wherein each electrical actuator includes an electrical heater configured to impart the bending of the actuator bridge, through thermal expansion.
8. An inkjet nozzle assembly as claimed in claim 6 , wherein the bridge includes a plurality of sets of thermally conductive strips with each set having different thermal conduction properties so as to facilitate bending of the bridge through differential thermal expansion.
9. An inkjet nozzle assembly as claimed in claim 1 , wherein the substrate defines an ink supply channel in fluid communication with the ink chamber.