Optical receiver module
View Patent ↗A semiconductor chip on which a light receiving element is mounted, a preamplifier for amplifying an output signal from the light receiving element, and an insulating carrier substrate on which the light receiving element is mounted are connected such that the output signal from the light receiving element is input to the preamplifier through electrodes on the carrier substrate, and there are provided two electrodes, on the carrier substrate, having a capacitance value of 40 fF or more therebetween in a state where no light receiving element is mounted.
1. An optical receiver module comprising:
a semiconductor chip on which is formed a photodiode for converting an optical signal into an electrical signal;
a carrier substrate for mounting said semiconductor chip;
a preamplifier for amplifying said electrical signal; and
a semiconductor mounting position having a pair of first electrodes formed on the carrier substrate,
wherein said carrier substrate is composed of a dielectric material,
wherein a capacitance between said pair of first electrodes of the carrier substrate is greater than or equal to 40 fF prior to mounting the semiconductor chip,
wherein on said semiconductor chip is formed an anode electrode and a cathode electrode which are connected to the photodiode and the semiconductor chip is mounted on the semiconductor mounting position such that the anode electrode and cathode electrode are connected to the pair of first electrodes,
wherein a capacitance between said anode electrode and said cathode electrode is less than or equal to 100 fF prior to mounting to the carrier substrate, and
wherein said optical receiver is operated with a bit rate of approximately 10 Gbits/s.
2. An optical receiver module according to claim 1 ,
wherein said carrier substrate is further formed a second semiconductor mounting position having a pair of second electrodes,
a capacitance between said second electrodes is less than 40 fF prior to mounting the semiconductor chip.
3. The optical receiver module according to claim 2 ,
wherein the capacitance between said second electrodes is less than 10 fF prior to mounting the semiconductor chip.
4. The optical receiver module according to claim 2 ,
wherein an input impedance of said preamplifier is less than or equal to 30Ω.
5. The optical receiver module according to claim 2 ,
wherein a power voltage of said preamplifier is less than or equal to 3.3V.
6. The optical receiver module according to claim 2 ,
wherein said photodiode is formed on a front surface of the semiconductor chip,
said semiconductor chip is a back surface illuminating type, and
said semiconductor chip is mounted on said carrier substrate by face down mounting.
7. The optical receiver module according to claim 2 ,
wherein said carrier substrate and said preamplifier are provided on a metal stem in a CAN-type case.
8. The optical receiver module according to claim 1 ,
wherein an input impedance of said preamplifier is less than or equal to 30Ω.
9. The optical receiver module according to claim 1 ,
wherein a power voltage of said preamplifier is less than or equal to 3.3V.
10. The optical receiver module according to claim 1 ,
wherein said photodiode is formed on a front surface of the semiconductor chip,
said semiconductor chip is a back surface illuminating type, and
said semiconductor chip is mounted on said carrier substrate by face down mounting.
11. The optical receiver module according to claim 1 ,
wherein said carrier substrate and said preamplifier are provided on a metal stem in a CAN-type case.