Sputtering apparatus and driving method thereof
View Patent ↗A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier.
1. A sputtering apparatus for depositing a target material on a substrate, comprising:
a carrier to carry the substrate;
a first chamber to measure a bending degree to which the carrier bends; and
a second chamber including a target for the target material, a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier, and a plurality of moving units to move the plurality of masks, respectively,
wherein the plurality of masks are each movable individually depending on the bending degree of the carrier.
2. The apparatus according to claim 1 , wherein the carrier is movable back and forth with respect to the target.
3. The apparatus according to claim 1 , further comprising a moving unit to move the carrier.
4. The apparatus according to claim 1 , wherein the plurality of masks include first to fourth masks that are arranged along the sides of the carrier.
5. The apparatus according to claim 1 , further comprising a plurality of moving units that move the plurality of the masks, respectively.
6. The apparatus according to claim 5 , wherein the plurality of moving units include first to fourth moving units that are connected to the plurality of masks, respectively.
7. The apparatus according to claim 5 , wherein the plurality of masks are movable individually.
8. The apparatus according to claim 5 , wherein the plurality of masks are movable at the same time.
9. The apparatus according to claim 1 , wherein, after each of the plurality of masks is moved, a gap between each of the plurality of masks and the substrate is approximately 5 mm.
10. A method of driving a sputtering apparatus including a first chamber to measure a degree to which a carrier carrying a substrate bends, and a second chamber including a target for a target material, a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier, and a plurality of moving units to move the plurality of masks, respectively, the method comprising:
measuring the degree to which the carrier bends when the carrier with the substrate are transferred in the first chamber;
transferring the carrier with the substrate from the first chamber to the second chamber, wherein the carrier is moved to face the target;
moving the carrier toward the target;
moving each of the plurality of masks toward the carrier depending on the bending degree of the carrier; and
performing a sputtering process, thereby depositing the target material from the target onto the substrate.
11. The method according to claim 10 , wherein the plurality of masks are movable individually.
12. The method according to claim 10 , wherein the plurality of masks are movable at the same time.
13. The method according to claim 10 , wherein, after each of the plurality of masks and the carrier are moved, a gap between each of the plurality of masks and the substrate is approximately 5 mm.
14. The method according to claim 10 , further comprising moving each of the plurality of masks away from the carrier and moving the carrier away from the target after a predetermined process.