Encapsulated structural adhesive
View Patent ↗The invention teaches an encapsulated curable adhesive composition especially adapted for use as a structural adhesive. The adhesive composition enables formation of a thin layer reactive composition of microcapsules and a two-part curative. The adhesive composition comprises a first population of microcapsules encasing a monomer and a first-part curative comprising an initiator. The adhesive composition further comprises a second-part curative. The second-part curative comprises an activator and a catalyst. At least the activator of the second-part curative is preferably encapsulated in a second population of microcapsules. The catalyst and the second population of microcapsules can be dispersed in a binder material, along with the first population of microcapsules. The first population of microcapsules contain encapsulated within the core a monomer having a Tg 35° C. or less and the first-part curative. The first population microcapsules contain encapsulated within the core a monomer having a Tg 35° C. or less along with the first-part curative. The encapsulated monomer and first-part curative constitute a blend which is a free flowing liquid having a viscosity of less than 500 Cp (milliPascal-second), and more preferably less than 10 Cp (milliPascal-second). The first population of microcapsules with first-part curative, and a second-part curative and second population of microcapsules are dispersed in a binder material. Reactive contact of the monomer and first-part curative with the second-part curative is affected by exuding the respective capsule contents into reactive contact through breakage of the microcapsules such as an interference fit of the substrate or substrates to which the composition is applied.
1. An encapsulated curable adhesive composition comprising:
a) a two part curative, comprising a first-part curative comprising a free radical initiator and a second-part curative,
b) a first population of polymeric microcapsules encasing both a monomer and the first-part curative forming a monomer and free radical initiator blend, the monomer being reactive with the second part curative, the first population of polymeric microcapsules being substantially impermeable to both parts of the curative,
the monomer being a mixture of a first monomer component having a viscosity greater than 500 milliPascal-second selected from the group consisting of 50 parts of melamine acrylate, 40 parts of epoxy acrylate, 50 parts of urethane dimethacrylate and 50 parts of polybutadiene; and a second monomer component being the balance to make 100 parts by weight of monomer, the second monomer component being a 50/50 ratio by weight of a blend of hexane diol dimethacrylate and tetrahydrofurfuryl methacrylate, wherein the viscosity of the mixture of the first monomer component and the second monomer component is less than 500 milliPascal-second,
wherein the monomer and the free radical initiator blend has a viscosity of a free flowing liquid of less than 500 milliPascal-second at 25° C.,
c) the second-part curative comprising a catalyst and an activator, the second-part curative being external to the first population of microcapsules and
wherein the activator of the second-part curative is separately encapsulated forming a second population of polymeric microcapsules.
2. The adhesive according to claim 1 wherein the encapsulated monomer and initiator blend has a viscosity of a flowing liquid of 25 Centipoise or less.
3. The encapsulated curable adhesive according to claim 1 wherein the catalyst is selected from the group consisting of a transition metal, a transition metal salt and an organic acid.
4. The encapsulated adhesive according to claim 3 Wherein the catalyst is selected from the group consisting of a copper salt and an organo copper compound.
5. The encapsulated adhesive according to claim 1 wherein the activator is an organonitrogen compound.
6. The encapsulated adhesive according to claim 5 wherein the activator is selected from the group consisting of diphenyl carbazine, diphenyl carbazone, propyl dihydropyridine, and diethyl-1,2-dihydro-1-phenyl-2-propyl pyridine.
7. The encapsulated adhesive according to claim 1 further comprising a binder for the first population of microcapsules and the second-part curative.
8. The encapsulated adhesive according to claim 1 wherein the initiator is a peroxy initiator.
9. The encapsulated curable adhesive according to claim 1 further comprising one or more binder materials in which the microcapsules, and second-part curative are dispersed.
10. The encapsulated curable adhesive according to claim 9 wherein the binder material is UV curable, and includes a UV initiator.
11. A coated substrate with a preapplied encapsulated curable adhesive composition comprising a substrate and one or more layers of an encapsulated curable adhesive composition, wherein the encapsulated curable adhesive composition comprises:
a) a two part curative, comprising a first-part curative comprising a free radical initiator and a second-part curative,
b) a first population of polymeric microcapsules encasing both a monomer and the first-part curative forming a monomer and free radical initiator blend, the monomer being reactive with the second part curative, the first population of polymeric microcapsules being substantially impermeable to both parts of the curative,
the monomer being a mixture of a first monomer component having a viscosity greater than 500 milliPascal-second selected from the group consisting of 50 parts of melamine acrylate, 40 parts of epoxy acrylate, 50 parts of urethane dimethacrylate and 50 parts of polybutadiene; and a second monomer component being the balance to make 100 parts by weight of monomer, the second monomer component being a 50/50 ratio by weight of a blend of hexane diol dimethacrylate and tetrahydrofurfuryl methacrylate, wherein the viscosity of the mixture of the first monomer component and the second monomer component is less than 500 milliPascal-second,
wherein the monomer and the free radical initiator blend has a viscosity of a free flowing liquid of less than 500 milliPascal-second at 25° C.,
c) the second-part curative comprising a catalyst and an activator, the second-part curative being external to the first population of microcapsules and
wherein the activator of the second-part curative is separately encapsulated forming a second population of polymeric microcapsules.
12. Coated substrate with adhesive composition according to claim 11 wherein the binder layers comprise at least three layers, with a first binder layer having dispersed therein at least the first population of microcapsules, with a second binder layer having dispersed therein one or more of activator, catalyst or the second population of microcapsules, with a third binder layer having dispersed therein one or more of activator or catalyst, wherein the binder layers have the same or different binders.
13. Coated substrate with adhesive composition according to claim 12 wherein at least two of the binder layers are each individually applied to one or more surfaces of substrates intended to be adhered, and the third binder layer is applied as an overcoat layer over either of the first two binder layers.
14. Coated substrate with adhesive according to claim 11 wherein the monomer and initiator blend has a viscosity of a flowing liquid of 25 milliPascal-second or less.
15. Coated substrate with adhesive according to claim 11 wherein the catalyst is selected from the group consisting of a transition metal, transition metal salt, and organic acid.
16. Coated substrate with adhesive according to claim 15 wherein the catalyst is selected from the group consisting of a copper salt and an organo copper compound.
17. Coated substrate with adhesive according to claim 11 wherein the activator is an organonitrogen compound.
18. Coated substrate with adhesive according to claim 17 wherein the activator is selected from the group consisting of diphenyl carbazine, diphenyl carbazone, propyl dihydropyridine and 3,5-diethyl-1,2-dihydro-1-phenyl-2-pyropyl pyridine.
19. Coated substrate with adhesive according to claim 11 wherein the initiator is a peroxy initiator.
20. Coated substrate with adhesive according to claim 11 further comprising one or more binder materials in which the microcapsules, and second-part curative are dispersed.
21. The encapsulated curable adhesive according to claim 11 wherein the binder is UV curable, and includes a UV initiator.