Feedthru assembly

1. A feedthru assembly configured to provide a conductive path extending between an interior of an enclosure and an exterior of said enclosure, comprising:

a flange configured to couple to said enclosure, said flange having one or more holes therein;

at least one conductive pin configured to extend through said one or more holes of said flange such that a proximal end of said at least one pin is in communication with said interior of said enclosure and a distal end of said at least one pin is in communication with said exterior of said enclosure; and

at least one insulative member configured to prevent said at least one pin from making physical contact with said flange;

wherein said at least one pin comprises a hollow lumen extending completely therethrough and configured to facilitate passage therethrough of one or more conductive wires.

2. The feedthru assembly of claim 1 , wherein said at least one pin is hermetically coupled to said at least one insulative member.

3. The feedthru assembly of claim 1 , wherein said at least one insulative member is hermetically coupled to said flange.

4. The feedthru assembly of claim 1 , wherein said flange is hermetically coupled to said enclosure.

5. The feedthru assembly of claim 1 , wherein said at least one insulative member comprises at least one insulative tube configured to surround an outer surface of said at least one pin.

6. The feedthru assembly of claim 1 , wherein said enclosure is configured to house electronic circuitry.

7. The feedthru assembly of claim 1 , wherein said enclosure is configured to be implanted within a patient.

8. The feedthru assembly of claim 1 , wherein said at least one pin is configured to serve as an electrode.

9. A method of making a feedthru assembly configured to provide a conductive path extending between an interior of an enclosure and an exterior of said enclosure, comprising:

providing at least one conductive pin having a hollow lumen extending completely therethrough;

at least partially surrounding an outer surface of said at least one pin with at least one insulative member; and

coupling an outside surface of said at least one insulative member to a flange;

wherein said flange is coupled to said enclosure such that a proximal end of said at least one pin is in communication with said interior of said enclosure and a distal end of said at least one pin is in communication with said exterior of said enclosure.

10. The method of claim 9 , wherein said hollow lumen is configured to facilitate a passage of one or more conductive wires from said proximal end to said distal end of said at least one pin.

11. The method of claim 9 , further comprising hermetically coupling said at least one pin to said at least one insulative member.

12. The method of claim 9 , wherein said flange is hermetically coupled to said enclosure.

13. The method of claim 9 , wherein said at least one insulative member comprises at least one insulative tube configured to surround an outer surface of said at least one pin.

14. The method of claim 9 , wherein said enclosure is configured to house electronic circuitry corresponding to an implantable medical device.

15. A method of facilitating electrical communication between a first component housed by an enclosure to a second component located externally to said enclosure, comprising:

coupling at least one conductive wire to said first component prior to said first component being inserted into said enclosure;

guiding said at least one conductive wire completely through a lumen of at least one conductive pin, said pin having a proximal end in communication with an interior of said enclosure and a distal end in communication with an exterior of said enclosure;

pulling said at least one wire to position said first component within said enclosure; and

electrically coupling said at least one wire to said at least one pin.

16. The method of claim 15 , further comprising electrically coupling said second component to said at least one pin.

17. The method of claim 15 , further comprising hermetically sealing said at least one wire to said at least one pin.

18. The method of claim 15 , further comprising surrounding at least a portion of an outer surface of said at least one pin with at least one insulative member.

19. The method of claim 15 , wherein said first component comprises electronic circuitry corresponding to an implantable medical device.

20. The method of claim 15 , further comprising:

trimming a distal portion of said at least one wire located external to said enclosure; and

hermetically coupling said at least one wire to said at least one conductive pin.