Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer
View Patent ↗The metal wirings of the uppermost layer are exposed so as to be contactable to the probe and arranged so as to be spatially separated from one another via spaces that are approximately parallel to the longitudinal direction of the dicing area, and the position and size of the space is designed considering a thickness of a cutting edge of a blade and relative positioning error, and the blade does not cross any metal wirings when the blade passes through the dicing area, thereby preventing the generation of an abruption or a burr due to the dicing to enhance a yield in IC production.
1. A method for dicing a semiconductor wafer having:
a plurality of chip areas in which a number of semiconductor elements are formed;
a dicing area provided at the outside of each chip area;
a characteristic evaluating element formed in the dicing area; and
a metal wiring formed in the dicing area and electrically connected to the characteristic evaluating element;
this method including a step of relatively moving a blade along a longitudinal direction of the dicing area for cutting a portion of the dicing area out,
wherein a coordinate axis Y is defined by a dicing center line, a coordinate axis X is defined by a direction perpendicular to the dicing center line, D is defined by a thickness of a cutting edge of the blade and ±σ is defined by a relative positioning error between the dicing blade and the semiconductor wafer in the direction of X and, in case where the dicing area is demarcated into five areas that are an area A (−D/2+σ<x<D/2−σ), an area B 1 (−D/2−σ<x<−D/2+σ), an area B 2 (D/2−σ<x<D/2+σ), an area C 1 (x<−D/2−σ) and an area C 2 (D/2+σ<x) the metal wiring is exposed in any one of areas of A, Cl and C 2 while the metal wiring is not exposed in the areas B 1 and B 2 .
2. The method according to claim 1 , wherein the metal wirings of plural layers is formed in the dicing area and the metal wiring of the uppermost layer is arranged in any one of areas A, C 1 and C 2 and the metal wiring of the inner layer is arranged so as to cross any one of the areas B 1 and B 2 .
3. The method according to claim 1 , wherein the metal wirings of plural layers is formed in the dicing area and the metal wiring for bridging is exposed at the cross-point in the overlapped area of both the area A relating to the dicing area in the X-direction and the area A relating to the dicing area in the Y-direction.
4. The method according to claim 1 , wherein a passivation film is formed on the metal wiring exposed in the area C 1 or C 2 .
5. The method according to claim 1 , wherein the metal wiring includes plural layers, and one inner layer of the plural layers is arranged in any one of the areas of A, C 1 and C 2 while the one inner layer is not arranged in the areas B 1 and B 2 .