IP Library Granted Patent US 8,356,658
Granted Patent B2
US 8,356,658 · App. 11/460,362 · Granted Jan 22, 2013

Heat transfer enhancing system and method for fabricating heat transfer device

Inventors: Ronald Scott Bunker (Niskayuna, NY); Wayne Charles Hasz (Pownal, VT)
Assignee: General Electric Company
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Quick Facts
Patent No.
US 8,356,658
App. No.
11/460,362
Granted
Jan 22, 2013
Kind
B2
Abstract

A heat transfer device includes a plurality of heat transfer walls configured to separate a first fluid and a second fluid. A heat transfer enhancing system is provided to one or more heat transfer walls. The heat transfer enhancing system includes a plurality of micro turbulating particles bonded to the one or more heat transfer walls using a binding medium.

Claims (9)

1. A natural gas heat exchanger, comprising:

at least one heat transfer wall configured to separate liquid natural gas and sea water,

a heat transfer enhancing system provided to the at least one heat transfer wall and comprising a plurality of micro turbulating particles bonded to the at least one heat transfer wall, or portions thereof, using a binding medium, wherein at least some of the micro turbulating particles are bonded together to form one or more agglomerations of micro turbulating particles, wherein each of the one or more agglomerations of micro turbulating particles does not allow liquid flow to penetrate inside the agglomeration, and an open rack vaporizer having the at least one heat transfer wall.

2. The heat exchanger of claim 1 , wherein the open rack vaporizer comprises a heating zone and a vaporizing zone having the plurality of micro turbulating particles provided in a predetermined pattern to the heating zone and the vaporizing zone using the binding medium.

3. The heat exchanger of claim 1 , wherein the plurality of micro turbulating particles are bonded to a plurality of fins or protrusions on the at least one heat transfer wall using the binding medium.

4. The heat exchanger of claim 1 , wherein the plurality of micro turbulating particles are bonded to an outlet side of the heat transfer wall, wherein the outlet side includes a heating zone.

5. The heat exchanger of claim 1 , wherein the one or more agglomerations comprises at least two agglomerations bonded to the heat transfer wall but not bonded to each other.

6. The heat exchanger of claim 1 , wherein spacing between micro turbulating particles is in the range of 2 to 8 times an average diameter of the micro turbulating particle.

7. The heat exchanger of claim 1 , wherein each micro turbulating particle has a height in the range of 1 to 6 times an average diameter of the micro turbulating particles.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2020
From: GENERAL ELECTRIC COMPANY
To: NUOVO PIGNONE TECHNOLOGIE S.R.L.
Reel/Frame 052185/0507 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2006
From: BUNKER, RONALD SCOTT; HASZ, WAYNE CHARLES
To: GENERAL ELECTRIC COMPANY
Reel/Frame 018012/0706 →
Continuity (1)
Related Publication 20080023179A1 · Jan 31, 2008