Patterning and treatment methods for organic light emitting diode devices
View Patent ↗A thermal transfer donor element is provided which can include a support, light-to-heat conversion layer, interlayer, and transfer layer. When the donor element is brought into contact with a receptor and imagewise irradiated, an image is obtained which is free from contamination by the light-to-heat conversion layer. In order to enhance the lifetimes of the transferred material, thermal treatments such as annealing are applied to the receptor before transfer, to the transfer layer after transfer, or a combination of them. The construction and process of the donor element is useful in making colored images including applications such as color proofs, color filter elements, and organic light emitting diode displays and devices.
1. A process for transferring an image onto a receptor, comprising the steps of:
providing on a substrate a light-to-heat conversion layer and a transfer layer coated on the light-to-heat conversion layer, the transfer layer including an organic material;
placing the transfer layer in contact with a surface of the receptor;
irradiating the light-to-heat conversion layer in an imagewise pattern with a light source to thermally transfer portions of the transfer layer corresponding to the imagewise pattern to the receptor, forming on the receptor organic interfaces between the transferred portions and the receptor;
annealing at least one layer on the receptor prior to the irradiating step; and
annealing the portions of the transfer layer after transfer to the receptor, the annealing comprising applying a thermal treatment to the organic interfaces before applying additional layers to the transferred portions, the thermal treatment being sufficient to reduce defects within the organic interfaces.
2. The process of claim 1 , further comprising performing the annealing in an inert or vacuum controlled environment.
3. The process of claim 1 , further comprising disposing an interlayer between the light-to-heat conversion layer and the transfer layer prior to the placing step.
4. The process of claim 1 , further comprising applying a hole injection layer on the receptor prior to the placing step.
5. The process of claim 4 , further comprising annealing the hole injection layer prior to the irradiating step.
6. The process of claim 1 , further comprising applying a hole transport layer on the receptor prior to the placing step.
7. The process of claim 6 , further comprising annealing the hole transport layer prior to the irradiating step.
8. The process of claim 1 , wherein the receptor comprises one of glass, a transparent film, or a liquid crystal display substrate.