Mounting structure, electro-optical device, and electronic apparatus
View Patent ↗A mounting structure is provided. The mounting structure includes: a substrate; a line formed on the substrate; an electronic component in which a terminal having a protrusion protruded to the substrate and made of an elastic material and a conductive member disposed on the protruded surface of the protrusion and electrically connected to the line is disposed on a mounting surface of the electronic component opposed to the substrate; and an adhesive in which metal powders, a part of which is interposed between the conductive member and the line, are mixed and which serves to bond and fix the electronic component to the substrate. Here, the conductive member and the line interpose the metal powders therebetween and come in surface-contact with each other.
1. An electro-optical device comprising:
a substrate;
a wire formed on the substrate;
an electronic component having a terminal composed of an elastic member protruding toward the substrate, and a conductive member disposed on a substrate-side surface of the elastic member; and
an adhesive disposed between the conductive member and the wire and connecting the electronic component to the substrate,
the adhesive including metal powder having a hardness equal to or greater than a hardness of at least one of the conductive member and the wire,
wherein the metal powder forms concavities in at least one of a contact area between the metal powder and the conductive member, and a contact area between the metal powder and the wire, and
wherein the conductive member and the wire are adhered in surface contact with each other in an area between the metal powder.
2. The electro-optical device according to claim 1 , wherein the concavities are formed in the conductive member.
3. The electro-optical device according to claim 1 , wherein a particle size of the metal powder is smaller than a combined thickness of the conductive member and the wire where the conductive member and the wire are adhered in surface contact with each other.
4. An electro-optical device according to claim 1 , wherein the substrate is an electro-optical device substrate.
5. An electro-optical device according to claim 1 , wherein the substrate is a circuit substrate which is electrically connected to an electro-optical device substrate.
6. The electro-optical device according to claim 1 , wherein a percentage of the metal powder added to the adhesive is 0.5 wt % or more and 30 wt % or less.
7. The electro-optical device according to claim 1 , further comprising an oxide film that covers at least one of a surface of the conductive member and a surface of the wire, wherein the oxide film has an opening formed by the metal powder disposed to contact the conductive member and the wire.
8. An electronic apparatus comprising the electro-optical device according to claim 1 .