Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
View Patent ↗In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
1. An optoelectronic semiconductor chip component having a two-pole surface mount technology (SMT) miniature housing in lead frame technique, comprising:
an optoelectronic semiconductor chip;
a first lead frame part having the optoelectronic semiconductor chip mounted thereon at a chip mounting surface thereof and a second lead frame part being electrically connected to the optoelectronic semiconductor chip;
a housing partially surrounding the first and second lead frame parts and having a component surface that faces an electrical board when the housing is mounted on the electrical board;
said chip mounting surface and said component surface being substantially at right angles with respect to one another; and
said first lead frame part and said second lead frame part being conducted out of the housing at opposite sides of the housing and each having a leg portion outside the housing for serving as a respective solder terminal running adjacent the opposite sides of the housing and extending to at least the component surface.
2. The optoelectronic semiconductor chip component according to claim 1 , said first and second lead frame parts being punched parts such that no trimming and shaping of the solder terminals which exerts bending stress on the housing is carried out when forming the solder terminals.
3. The optoelectronic semiconductor chip component according to claim 1 , wherein the component surface is substantially flat and, when the housing is mounted on the electrical board, the component surface is substantially parallel to the electrical board.
4. The optoelectronic semiconductor chip component according to claim 1 , wherein the electrical board includes at least one of: a printed circuit board, and a mother board.
5. The optoelectronic semiconductor chip component according to claim 1 , wherein the housing is constructed from plastic.
6. The optoelectronic semiconductor chip component according to claim 1 , wherein the housing has a longitudinal axis and a transverse axis, the longitudinal axis being longer than the transverse axis, and wherein the opposite sides are positioned proximate the respective ends of the longitudinal axis.
7. The optoelectronic semiconductor chip component according to claim 1 wherein the solder terminals have a thickness of approximately 0.2 mm-0.5 mm.
8. The optoelectronic semiconductor chip component according to claim 1 wherein the optoelectronic chip component has side-looking emission characteristics.
9. The optoelectronic semiconductor chip component according to claim 1 wherein the optoelectronic chip component has side-looking reception characteristics.
10. The optoelectronic semiconductor chip component according to claim 1 wherein the optoelectronic semiconductor chip is encapsulated with a casting resin inside the recess.
11. An optoelectronic semiconductor chip component having a two-pole surface mount technology (SMT) miniature housing in lead frame technique, comprising:
an optoelectronic semiconductor chip;
a first lead frame part having the optoelectronic semiconductor chip mounted thereon at a chip mounting surface thereof and a second lead frame part being electrically connected to the optoelectronic semiconductor chip;
a housing partially surrounding the first and second lead frame parts and having a component surface that faces an electrical board when the housing is mounted on the electrical board;
said chip mounting surface and said component mounting surface being substantially at right angles with respect to one another;
said first lead frame part and said second lead frame part being conducted out of the housing at opposite sides of the housing and each having a leg portion outside the housing for serving as a respective solder terminal running adjacent the opposite sides of the housing and extending to at least the component surface; and
said first and second lead frame parts being punched parts such that during the entire method at transition regions from said first lead frame part and said second lead frame part to the respective leg portions no trimming and shaping which exerts bending stress on the housing is carried out.
12. The optoelectronic semiconductor chip component according to claim 11 , wherein the component surface is substantially flat and, when the housing is mounted on the electrical board, the component surface is substantially parallel to the electrical board.
13. The optoelectronic semiconductor chip component according to claim 11 , wherein the housing is constructed from plastic.
14. The optoelectronic semiconductor chip component according to claim 11 , wherein the electrical board includes at least one of: a printed circuit board, and a mother board.
15. The optoelectronic semiconductor chip component according to claim 11 , wherein the housing has a longitudinal axis and a transverse axis, the longitudinal axis being longer than the transverse axis, and wherein the opposite sides are positioned proximate the respective ends of the longitudinal axis.
16. The optoelectronic semiconductor chip component according to claim 11 wherein the solder terminals have a thickness of approximately 0.2 mm-0.5 mm.
17. The optoelectronic semiconductor chip component according to claim 11 wherein the optoelectronic chip component has side-looking emission characteristics.
18. The optoelectronic semiconductor chip component according to claim 10 wherein the optoelectronic chip component has side-looking reception characteristics.
19. The optoelectronic semiconductor chip component according to claim 10 wherein the optoelectronic semiconductor chip is encapsulated with a casting resin inside the recess.
20. An optoelectronic semiconductor chip component having a two-pole surface mount technology (SMT) miniature housing in lead frame technique, comprising:
an optoelectronic semiconductor chip;
a first lead frame part having the optoelectronic semiconductor chip mounted thereon at a chip mounting surface thereof and a second lead frame part being electrically connected to the optoelectronic semiconductor chip;
a housing partially surrounding the first and second lead frame parts and having a component surface that faces an electrical board when the housing is mounted on the electrical board;
said chip mounting surface and said component mounting surface being substantially at right angles with respect to one another;
said first lead frame part and said second lead frame part being conducted out of the housing at opposite sides of the housing and each having a leg portion outside the housing for serving as a respective solder terminal running adjacent the opposite sides of the housing and extending to at least the component surface; and
said first and second lead frame parts being punched parts fabricated with no trimming and shaping at transition regions where said first lead frame part and said second lead frame part are conducted out of the housing to their respective leg portions.
21. The optoelectronic semiconductor chip component according to claim 20 , wherein the component surface is substantially flat and, when the housing is mounted on the electrical board, the component surface is substantially parallel to the electrical board.
22. The optoelectronic semiconductor chip component according to claim 20 , wherein the housing is constructed from plastic.
23. The optoelectronic semiconductor chip component according to claim 20 , wherein the electrical board includes at least one of: a printed circuit board, and a mother board.
24. The optoelectronic semiconductor chip component according to claim 20 , wherein the housing has a longitudinal axis and a transverse axis, the longitudinal axis being longer than the transverse axis, and wherein the opposite sides are positioned proximate the respective ends of the longitudinal axis.
25. The optoelectronic semiconductor chip component according to claim 20 wherein the solder terminals have a thickness of approximately 0.2 mm-0.5 mm.
26. The optoelectronic semiconductor chip component according to claim 20 wherein the optoelectronic chip component has side-looking emission characteristics.
27. The optoelectronic semiconductor chip component according to claim 20 wherein the optoelectronic chip component has side-looking reception characteristics.
28. The optoelectronic semiconductor chip component according to claim 20 wherein the optoelectronic semiconductor chip is encapsulated with a casting resin inside the recess.
29. The optoelectronic semiconductor chip component according to claim 1 , the housing further having a recess extending from another surface of the housing to the chip mounting surface.
30. The optoelectronic semiconductor chip component according to claim 11 , the housing further having a recess extending from another surface of the housing to the chip mounting surface.
31. The optoelectronic semiconductor chip component according to claim 20 , the housing further having a recess extending from another surface of the housing to the chip mounting surface.