Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components
View Patent ↗A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.
1. A hermetically sealed electronics packaging architecture comprising:
a generally hollow housing body, made of a first material that is electrically conductive and has a relatively low coefficient of thermal expansion (CTE), and having a relatively thin wall upon which heat-generating electronic circuit components are supported and through which heat generated by said components is to be extracted; and
an auxiliary, heat-dissipating, insert, having a top surface that is configured to support said heat-generating electronic circuit components, and being made of a second material, different from said first material, and having a relatively high electrical and thermal conductivity, and having a relatively low coefficient of thermal expansion that is approximate to that of said first material, and having a bottom surface that effectively conforms with an interior surface of said wall of said housing body, and being compressed thereagainst by way of fittings, that are retained in apertures through said wall of said housing body and are hermetically sealed against an exterior surface of said wall of said housing body, whereby thermal energy emanating from electronic circuit components supported on said top surface of said insert is dispersed through said insert and said wall of said housing body, and radiates out said exterior surface of said housing body, thereby cooling said electronic circuit components.
2. The packaging architecture according to claim 1 , wherein said top surface of said insert is selectively contoured, to effectively provide for matched impedance transitions in wires that extend between respective ones of electronic circuit components supported thereby, and to facilitate wire-bonding to lead attachment locations of said electronic circuit components.
3. The packaging architecture according to claim 1 , wherein said first material has a first specific gravity, and said second material has a second specific gravity that is less than said first specific gravity.
4. The packaging architecture according to claim 3 , wherein said first material comprises titanium and said second material comprises aluminum/silicon alloy.
5. The packaging architecture according to claim 1 , wherein said top surface of said insert is configured to receive and directly abut against bottom surfaces of said electronic circuit components supported thereon, and wherein the total area of said top surface of said insert is greater than the total area of said bottom surfaces of said electronic circuit components.
6. The packaging architecture according to claim 1 , wherein said fittings pass through bores in said insert and said apertures through said wall of said housing body.
7. The packaging architecture according to claim 6 , wherein said fittings are made of said first material.
8. A hermetically sealed electronics packaging architecture for housing a plurality of heat-generating electronic circuit components comprising:
a housing body, made of a first material that is electrically conductive and has a relatively low coefficient of thermal expansion (CTE), and having a plurality of sidewalls that are joined with a relatively thin, bottom wall/floor and define therewith a generally hollow interior volume, said sidewalls being adapted to receive a cover that hermetically closes said interior volume of said housing body, and wherein one or more electrical connectors that provide electrical connections to said electronic circuit components are hermetically sealed with one or more of said sidewalls;
a heat-dissipating, electronic circuit component-supporting, insert, having a top surface that is configured to support said electronic circuit components thereon, and being made of a second material, that is different from said first material, said second material having a relatively high electrical and thermal conductivity, and having a relatively low coefficient of thermal expansion that is approximate to that of said first material, said insert having a bottom surface that effectively conforms with an interior surface of said bottom wall/floor of said housing body, and is compressed thereagainst by way of fittings, that are mechanically joined with said insert and pass through apertures in said bottom wall/floor of said housing body, and are hermetically sealed against an exterior surface of said bottom wall/floor of said housing body, whereby thermal energy emanating from electronic circuit components supported on said top surface of said insert is dispersed through said insert and said bottom wall/floor of said housing body, and radiates out said exterior surface of said housing body, thereby cooling said electronic circuit components.
9. The packaging architecture according to claim 8 , wherein said top surface of said insert is selectively contoured, so as to effectively provide for matched impedance transitions in electrical connections that extend between respective ones of electronic circuit components supported thereby, and to facilitate wire-bonding to lead attachment locations of said electronic circuit components.
10. The packaging architecture according to claim 8 , wherein said first material has a first specific gravity, and said second material has a second specific gravity that is less than said first specific gravity.
11. The packaging architecture according to claim 10 , wherein said first material comprises titanium and said second material comprises aluminum/silicon alloy.
12. The packaging architecture according to claim 8 , wherein said top surface of said insert is configured to receive and directly abut against bottom surfaces of said electronic circuit components supported thereon, and wherein the total area of said top surface of said insert is greater than the total area of said bottom surfaces of said electronic circuit components.
13. The packaging architecture according to claim 8 , wherein said fittings are made of said first material and pass through bores in said internal insert that are aligned with said apertures through said bottom wall/floor of said housing body.
14. In an electronics packaging architecture having a housing body for supporting and hermetically sealing therein a plurality of heat-generating electronic circuit components, said housing body comprising a first material having a first specific gravity, and being electrically conductive and having a relatively low coefficient of thermal expansion (CTE), said housing body including a bottom wall and a plurality of sidewalls that are adapted to receive a cover and are joined with said bottom wall, so as to form a generally hollow interior volume of said housing body in which said electronic circuit components are hermetically sealed, and wherein one or more electrical connectors that provide electrical connections to said electronic circuit components are hermetically sealed with one or more of said sidewalls, the improvement comprising:
a heat-dissipating, electronic circuit component-supporting, insert, having a top surface that is configured to support said electronic circuit components thereon, and being made of a second material having a second specific gravity that is less than said first specific gravity, said second material having a relatively high electrical and thermal conductivity, and having a relatively low coefficient of thermal expansion that is approximate to that of said first material, said insert having a bottom surface, which effectively conforms with an interior surface of a wall of said housing body through heat generated by said electronic circuit components is to be removed, and wherein said of said housing body has a thickness that is reduced relative that of a housing body not containing said insert, so that the total mass of said wall of said housing body and said insert is less than the total mass of the wall of said housing body not containing said insert, and wherein said insert is compressed against said interior surface of said wall of said housing body so as to form a laminate structure therewith, by fittings, that are mechanically joined with said insert and pass through apertures in said wall of said housing body, and are hermetically sealed against an exterior surface of said wall of said housing body, whereby thermal energy emanating from electronic circuit components supported on said top surface of said insert is dispersed through said insert and said wall of said housing body, and radiates out said exterior surface of said housing body, thereby cooling said electronic circuit components.
15. The improvement according to claim 14 , wherein said top surface of said insert is selectively contoured, so as to effectively provide for matched impedance transitions in electrical connections that extend between respective ones of electronic circuit components supported thereby, and to facilitate wire-bonding to lead attachment locations of said electronic circuit components.
16. The improvement according to claim 14 , wherein said first material comprises titanium and said second material comprises aluminum/silicon alloy.
17. The improvement according to claim 14 , wherein said top surface of said insert is configured to receive and directly abut against bottom surfaces of said electronic circuit components supported thereon, and wherein the total area of said top surface of said insert is greater than the total area of said bottom surfaces of said electronic circuit components.
18. The improvement according to claim 14 , wherein said fittings are made of said first material and pass through bores in said internal insert that are aligned with said apertures through said wall of said housing body.
19. The improvement according to claim 14 , wherein said wall of said housing body corresponds to said bottom wall thereof.