Secure Gaming Chip
The present invention is directed to an article of manufacture that includes an RFID inlay having a programmable integrated circuit coupled to a propagation element on a first side of a rigid two-sided printed circuit board. The programmable integrated circuit is covered by a protective material having at least one material characteristic, whereby the programmable integrated circuit is hardened to withstand a predetermined applied pressure and a predetermined ambient temperature. At least one molded exterior portion encapsulates the RFID inlay. The at least one molded exterior portion is formed by an injection molding process characterized by a molding pressure that is lower than the predetermined applied pressure and a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the article of manufacture.
1 . An article of manufacture comprising:
an RFID inlay including a programmable integrated circuit coupled to a propagation element on a first side of a rigid two-sided printed circuit board, the programmable integrated circuit being covered by a protective material having at least one material characteristic, whereby the programmable integrated circuit is hardened to withstand a predetermined applied pressure and a predetermined ambient temperature; and
at least one molded exterior portion encapsulating the RFID inlay, the at least one molded exterior portion being formed by an injection molding process characterized by a molding pressure that is lower than the predetermined applied pressure and a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the article of manufacture.
2 . The article of claim 1 , wherein the article is a gaming chip having a diameter of approximately 39 millimeters.
3 . The article of claim 2 , wherein the at least one molded exterior portion further comprises an over-mold portion encapsulating at least a portion of an injection molded inner core portion.
4 . The article of claim 1 , wherein the propagation element is a near-field inductive coupler configured to communicate with a reader via a magnetic flux.
5 . The article of claim 4 , wherein the near-field inductive coupler is characterized by at least one geometric parameter.
6 . The article of claim 5 , wherein the at least one geometric parameter includes a coupler trace width, a coupler trace spacing, a coupler trace thickness, and/or an inductive coupler geometric pattern.
7 . The article of claim 5 , wherein the near-field inductive coupler is an LC circuit characterized by a resonant frequency.
8 . The article of claim 5 , wherein the RFID inlay operates in accordance with 13.56 MHz RFID frequencies.
9 . The article of claim 1 , wherein the molding temperature is approximately 300° C.
10 . The article of claim 1 , wherein the molding pressure is approximately 14 N/mm 2 .
11 . The article of claim 1 , wherein the at least one material characteristic includes a Shore D hardness value greater than or equal to 80.
12 . The article of claim 1 , wherein the at least one material characteristic includes a linear shrinkage of less than 0.5%.
13 . The article of claim 1 , wherein the at least one material characteristic includes a glass transition temperature greater than 130° C.
14 . The article of claim 1 , wherein the at least one material characteristic includes a thickness less than 50 mils.
15 . The article of claim 1 , wherein the propagation element is a radio antenna operating in a predetermined frequency band within an approximate range between 400 MHz and 960 MHz.
16 . A secure gaming chip comprising:
an RFID inlay including a programmable integrated circuit coupled to a propagation element on a first side of a rigid two-sided printed circuit board, the programmable integrated circuit being programmed to include a one-time password, the programmable integrated circuit being covered by a protective material having at least one material characteristic, whereby the programmable integrated circuit is hardened to withstand a predetermined applied pressure and a predetermined ambient temperature;
at least one molded exterior portion encapsulating the RFID inlay, the at least one molded exterior portion being formed by an injection molding process characterized by a molding pressure that is lower than the predetermined applied pressure and a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the gaming chip.
17 . The chip of claim 16 , wherein the at least one molded exterior portion further comprises an over-mold portion encapsulating at least a portion of an injection molded inner core portion.
18 . The chip of claim 17 , wherein the chip has a diameter of approximately 39 millimeters.
19 . The chip of claim 16 , wherein the programmable integrated circuit is programmed with a time stamped one-time password.
20 . The chip of claim 19 , wherein the one-time password is a 160 bit digital word generated by a one-way encryption algorithm.
21 . The chip of claim 16 , further comprising a magnetic marker disposed on a second side of the printed circuit board.
22 . The chip of claim 21 , wherein the magnetic marker is characterized by a unique predetermined magnetic material response waveform configured to respond to alternating magnetic interrogation fields generated by an electronic article surveillance system.
23 . The chip of claim 16 , wherein the propagation element is a near-field inductive coupler configured to communicate with a reader via a magnetic flux.
24 . The chip of claim 23 , wherein the near-field inductive coupler is characterized by a coupler trace width, a coupler trace spacing, a coupler trace thickness, and/or an inductive coupler geometric pattern based a on predetermined resonant frequency.
25 . The chip of claim 23 , wherein the near-field inductive coupler is an LC circuit characterized by a resonant frequency.
26 . The chip of claim 16 , wherein the RFID inlay operates at a carrier frequency of 13.56 MHz.
27 . The chip of claim 16 , wherein the molding temperature is approximately 300° C.
28 . The chip of claim 16 , wherein the molding pressure is approximately 14 N/mm 2 .
29 . The chip of claim 16 , wherein the at least one material characteristic includes a Shore D hardness value greater than or equal to 80.
30 . The chip of claim 16 , wherein the at least one material characteristic includes a linear shrinkage of less than 0.5%.
31 . The chip of claim 16 , wherein the at least one material characteristic includes a glass transition temperature greater than 130° C.
32 . The chip of claim 16 , wherein the protective material has an approximate thickness that is less than 30 mils.
33 . The chip of claim 32 , wherein the protective material has an approximate diameter that is less than 300 mils.
34 . The chip of claim 16 , wherein the propagation element is a radio antenna operating in an approximate range between 400 MHz and 915 MHz.
35 . A secure gaming chip comprising:
an RFID inlay including a programmable integrated circuit coupled to a propagation element on a first side of a rigid two-sided printed circuit board, the programmable integrated circuit being programmed to include a one-time password, the RFID inlay device also including a magnetic marker disposed on a second side of the printed circuit board, the magnetic marker being characterized by a unique predetermined magnetic material response waveform, the programmable integrated circuit being covered by a protective material having at least one material characteristic, whereby the programmable integrated circuit is hardened to withstand a predetermined applied pressure and a predetermined ambient temperature; and
an inner core portion encapsulating the RFID inlay and the protective material, the inner core portion being formed by an injection molding process characterized by a molding pressure that is lower than the predetermined applied pressure and a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the article of manufacture; and
an over-mold portion encapsulating at least a portion of the inner core portion, the over-mold portion being formed by an over-mold injection molding process.
36 . A method for making a gaming chip comprising:
providing an RFID inlay device including a programmable integrated circuit coupled to a propagation element disposed on a first side of a rigid two-sided printed circuit board;
disposing a protective material over the programmable integrated circuit on the first side, the protective material having at least one material characteristic protecting the programmable integrated circuit from a predetermined applied pressure and a predetermined ambient temperature;
disposing the RFID inlay covered by the protective material in a first injection mold; and
injecting a first plastic material into the first injection mold to encapsulate the RFID inlay and the protective material within a first article of manufacture, the plastic material being injected at a molding pressure that is lower than the predetermined applied pressure and at a molding temperature lower than the predetermined ambient pressure, whereby the RFID inlay is not accessible without destroying the article of manufacture.
37 . The method of claim 36 , further comprising:
disposing the first article of manufacture in a second injection mold;
injecting a second plastic material into the second injection mold to at least partially encapsulate the first article of manufacture within an outer portion; and
machining the outer portion and any exposed portions of the first article of manufacture to form a gaming chip.
38 . The method of claim 37 , wherein the gaming chip has a diameter of approximately 39 millimeters.
39 . The method of claim 37 , wherein the gaming chip has a diameter of approximately 43 millimeters.
40 . The method of claim 37 , wherein a shape of the gaming chip is selected from a group of shapes that include a circular shape, an oval shape, a hexagonal shape, a octagonal shape, a square shape, or a rectangular shape.
41 . The method of claim 37 , wherein the gaming chip has a major surface dimension within a range between 25-110 millimeters.
42 . The method of claim 36 , further comprising:
generating a one-time password using a one-way encryption algorithm;
writing the one-time password into a read/write memory disposed in the programmable integrated circuit.
43 . The method of claim 36 , wherein the read/write memory includes at least 500 bits of storage.
44 . The method of claim 43 , wherein the read/write memory includes approximately 2 Kbits of storage.
45 . The method of claim 36 , wherein the step of providing further comprises the step of disposing a magnetic marker on a second side of the printed circuit board, the magnetic marker being characterized by a unique predetermined magnetic material response waveform configured to respond to alternating magnetic interrogation fields generated by an electronic article surveillance system.
46 . The method of claim 45 , wherein the magnetic marker includes at least one magnetic ribbon.
47 . The method of claim 46 , further comprising:
machining a cross-shaped pattern in a surface of the first article of manufacture, the cross-shaped pattern including a first channel intersected by a second channel;
disposing a first magnetic ribbon in the first channel; and
disposing a second magnetic ribbon in the second channel.
48 . The method of claim 36 , wherein the step of providing includes flip-chip bonding the programmable integrated circuit to the propagation element disposed on the first side of the rigid two-sided printed circuit board.
49 . The method of claim 36 , wherein the step of providing includes wire bonding the programmable integrated circuit to the propagation element disposed on the first side of the rigid two-sided printed circuit board.