IP Library Granted Patent US 7,425,407
Granted Patent B1
US 7,425,407 · App. 11/465,358 · Granted Sep 16, 2008

Methods for fabricating optical microstructures by imaging a radiation sensitive layer sandwiched between outer layers

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Quick Facts
Patent No.
US 7,425,407
App. No.
11/465,358
Granted
Sep 16, 2008
Kind
B1
Abstract

Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.

Claims (29)

1. A method of fabricating a microlens array comprising:

imaging a microlens array master blank that comprises a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, by scanning a radiation beam through one of the outer layers and across at least a portion of the radiation sensitive layer at varying amplitude, to define the microlens array in the radiation sensitive layer; and

removing at least one of the outer layers, wherein the imaging platform comprises a cylindrical platform and wherein imaging comprises rotating the cylindrical platform about an axis thereof while simultaneously rastering the radiation beam through one of the outer layers and across at least a portion of the radiation sensitive layer.

2. A method according to claim 1 wherein imaging is preceded by:

placing the radiation sensitive layer sandwiched between a pair of outer layers on the imaging platform.

3. A method according to claim 1 further comprising simultaneously translating the cylindrical platform and/or radiation beam axially relative to one another.

4. A method according to claim 3 wherein the varying amplitude comprises a continuously varying amplitude.

5. A method according to claim 1 wherein the radiation sensitive layer is at least about one square foot in area.

6. A method according to claim 1 wherein imaging is performed continuously on the radiation sensitive layer for at least about 1 hour.

7. A method according to claim 1 wherein imaging is performed continuously on the radiation sensitive layer for at least about 1 hour to fabricate at least about one million microlenses.

8. A method according to claim 1 further comprising:

developing the microlens array that was defined in the radiation sensitive layer to provide a microlens array master.

9. A method according to claim 1 wherein the pair of outer layers are cylindrical, ellipsoidal or polygonal in shape.

10. A method according to claim 1 wherein the pair of outer layers comprise a first outer layer adjacent the imaging platform and a second outer layer remote from the imaging platform, the imaging comprising:

impinging the radiation beam through the second outer layer into the radiation sensitive layer to define the microlens array in the radiation sensitive layer.

11. A method according to claim 1 wherein the radiation sensitive layer is a negative photoresist layer such that portions of the negative photoresist layer that are exposed to the radiation beam remain after development.

12. A method according to claim 1 wherein the pair of outer layers are flexible.

13. A method of fabricating a microlens array master comprising:

placing on a cylindrical platform, a microlens array master blank that comprises a first outer layer, a negative photoresist layer on the first outer layer and a second outer layer on the negative photoresist layer, such that the first outer layer is adjacent the cylindrical platform and the second outer layer is remote from the cylindrical platform;

impinging a laser beam through the second outer layer into the negative photoresist layer while simultaneously rotating the cylindrical platform about an axis thereof and while simultaneously axially rastering the laser beam across at least a portion of the negative photoresist layer to image the microlens array in the negative photoresist layer;

separating the first outer layer from the cylindrical platform;

separating the first outer layer from the negative photoresist layer; and

developing the microlens array that was imaged in the negative photoresist layer.

14. A method according to claim 13 further comprising simultaneously translating the cylindrical platform and/or laser beam axially relative to one another.

15. A method according to claim 14 further comprising simultaneously continuously varying amplitude of the laser beam.

16. A method according to claim 13 wherein the microlens array master blank is at least about one square foot in area.

17. A method according to claim 16 wherein impinging is performed continuously on the microlens array master blank for at least about 1 hour.

18. A method according to claim 17 wherein impinging is performed continuously on the microlens master blank for at least about 1 hour to fabricate at least about one million microlenses.

19. A method according to claim 13 wherein the first and second outer layers are flexible.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Feb 9, 2021
From: TREDEGAR CORPORATION
To: BRIGHTVIEW TECHNOLOGIES, INC. (F/K/A BRIGHTVIEW TECHNOLOGIES CORPORATION)
Reel/Frame 055202/0474 →
SECURITY INTEREST Recorded Jun 25, 2019
From: BRIGHT VIEW TECHNOLOGIES CORPORATION
To: TREDEGAR CORPORATION
Reel/Frame 049582/0895 →
CHANGE OF NAME Recorded Nov 3, 2010
From: TREDEGAR NEWCO, INC.
To: BRIGHT VIEW TECHNOLOGIES CORPORATION
Reel/Frame 025244/0479 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2010
From: WOOD, ROBERT L.; RINEHART, THOMAS A.; FREESE, ROBERT P.
To: BRIGHT VIEW TECHNOLOGIES, INC.
Reel/Frame 025233/0413 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2010
From: BRIGHT VIEW TECHNOLOGIES, INC.
To: TREDEGAR NEWCO, INC.
Reel/Frame 024023/0442 →