Wiring board and method for manufacturing the same, and semiconductor device
View Patent ↗A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.
1. A wiring board, comprising:
an insulating base;
a plurality of conductive wirings provided on the insulating base; and
bumps formed on the plurality of conductive wirings, respectively,
wherein the plurality of conductive wirings can be connected with electrode pads of a semiconductor element to be mounted via the bumps, and
the plurality of conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component,
wherein the plurality of conductive wirings comprise first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region on which the semiconductor element is to be mounted,
the first conductive wirings extend from the bumps to the connection terminal portion for connection with the external component,
the second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion, and
end portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings.
2. The wiring board according to claim 1 , wherein the cutting portion of the second conductive wirings comprises a through hole formed in the insulating base.
3. The wiring board according to claim 1 , wherein the second conductive wirings disposed on opposed both sides of the semiconductor element mounting region are connected mutually.
4. A semiconductor device, comprising:
the wiring board according to claim 1 ; and
a semiconductor element mounted on the semiconductor element mounting region,
wherein electrode pads of the semiconductor element and the conductive wirings are connected via the bumps.
5. The semiconductor device according to claim 4 , wherein the cutting portion is formed by punching the insulating base, and the cutting portion is formed outside of a region where an encapsulation resin is applied for protecting the semiconductor element.
6. A method for manufacturing a wiring board comprising: an insulating base; a plurality of conductive wirings provided on the insulating base; and bumps formed on the plurality of conductive wirings, respectively, wherein the plurality of conductive wirings can be connected with electrode pads of a semiconductor element to be mounted via the bumps, and the plurality of conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component, the method comprising the steps of:
using the insulating base having first conductive wirings and second conductive wirings as the plurality of conductive wirings provided thereon, the first conductive wirings extending from a position where the bumps are to be formed to the connection terminal portion for connection with the external component and the second conductive wirings extending beyond a semiconductor element mounting region from the position where the bumps are to be formed and not reaching the connection terminal portion, the first conductive wirings and the second conductive wirings being connected electrically;
carrying out electroplating by feeding electricity via the second conductive wirings, so as to form the bumps on the first conductive wirings and the second conductive wirings; and
forming a cutting portion that separates the first conductive wirings and the second conductive wirings electrically.
7. The method for manufacturing a wiring board according to claim 6 , wherein the cutting portion is formed by punching the insulating base.
8. The method for manufacturing a wiring board according to claim 6 , wherein the cutting portion is formed by cutting the first conductive wirings and the second conductive wirings by laser.