Forming interconnects
A method for forming an electronic device, comprising: forming a first conductive or semiconductive layer; forming a sequence of at least on insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localized region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layer; and depositing conductive or semiconductive material in the void.
1. An electronic device formed by:
forming a first conductive or semiconductive layer;
forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer;
locally depositing solvents at a localized region of the sequence and forming a void in the sequence accompanied by redepositing material dissolved to form said void at a side of the void; and
depositing conductive or semiconductive material in the void.
2. An electronic device formed by:
forming a first conductive or semiconductive layer;
forming a soluble insulating or semiconducting layer over the first conductive or semiconductive layer;
locally depositing a solvent at a localized region of the soluble insulating or semiconducting layer, dissolving the soluble insulating or semiconducting layer, forming a void in said soluble insulating or semiconducting material and redepositing material dissolved to form said void at a side of the void; and
depositing conductive or semiconductive material in the void.
3. A logic circuit, display or memory device comprising a plurality of devices as claimed in claim 1 .
4. A logic circuit comprising a plurality of devices as claimed in claim 1 interconnected so as to perform a logical function.
5. A logic circuit as claimed in claim 4 , wherein at least a first one of the devices is connected to another of the devices by means of conductive material located in a void formed through at least one layer of the first one of the devices.
6. A display device comprising an optically active region switchable by an electronic device as claimed in claim 1 , the electronic device being coupled to the optically active region by means of conductive material located in a void formed through at least one layer of the device.
7. A logic circuit, display or memory device comprising a plurality of devices as claimed in claim 2 .
8. A logic circuit comprising a plurality of devices as claimed in claim 2 interconnected so as to perform a logical function.
9. A logic circuit as claimed in claim 8 , wherein at least a first one of the devices is connected to another of the devices by means of conductive material located in a void formed through at least one layer of the first one of the devices.
10. A display device comprising an optically active region switchable by an electronic device as claimed in claim 2 , the electronic device being coupled to the optically active region by means of conductive material located in a void formed through at least one layer of the device.