Transceiver module having a dual segment lead frame connector
View Patent ↗An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.
1. A lead frame connector, comprising:
an electrically insulating casing comprising:
first and second portions; and
a flexible portion interposed between, and attached to, the first and second portions; and
a plurality of conductors that are electrically isolated one from another, each of the plurality of conductors extending from the first portion through the flexible portion and into the second portion, and comprising:
an electrical contact portion configured to interface with a corresponding lead of an optical subassembly; and
a lead in electrical communication with the electrical contact portion, the lead being configured to interface with a corresponding element of a printed circuit board.
2. The lead frame connector as recited in claim 1 , wherein the flexible portion comprises either plastic or rubber.
3. The lead frame connector as recited in claim 1 , wherein:
the first portion comprises a first casing; and
the second portion comprises a second casing.
4. The lead frame connector as recited in claim 2 , wherein the conductors are bent at segments thereof between the first casing and the second casing.
5. The lead frame connector as recited in claim 1 , wherein the casing is insert injection molded over a portion of the plurality of conductors.
6. The lead frame connector as recited in claim 1 , wherein the first portion is oriented at an angle with respect to the second portion.
7. The lead frame connector as recited in claim 2 , wherein a configuration of the first and second casings corresponds with a desired impedance effect associated with the plurality of conductors.
8. The lead frame connector as recited in claim 3 , wherein a configuration of each of the plurality of conductors is associated with a particular impedance control effect.
9. The lead frame connector as recited in claim 1 , wherein electrical isolation of the conductors relative to each other is effected by the electrically insulating casing.
10. The lead frame connector as recited in claim 1 , wherein one of the portions of the casing is substantially perpendicular with respect to the other portion of the casing.
11. An optical subassembly attached to the lead frame connector of claim 1 .