Assembly for HPHT processing

1. An assembly for HPHT processing, comprising:

a can comprising an opening and a mixture disposed within the opening;

a substrate adjacent and above the mixture;

a sealant barrier positioned atop the substrate;

a first lid positioned atop the substrate and beneath an end of a folded can wall;

a second lid positioned above the folded can wall; and

a meltable sealant positioned intermediate the second lid and a cap covering the opening.

2. The assembly of claim 1 , wherein the second lid comprises a material selected from the group of a metal or metal alloy.

3. The assembly of claim 1 , wherein the first lid and can comprise niobium, niobium alloy, niobium mixture, or combinations thereof.

4. The assembly of claim 1 , wherein the mixture comprises a composite body comprising a substrate lying adjacent a plurality of superhard particles.

5. The assembly of claim 4 , wherein the superhard particles are selected from the group consisting of diamond, polycrystalline diamond, thermally stable products, polycrystalline diamond depleted of its catalyst, polycrystalline diamond having nonmetallic catalyst, cubic boron nitride, cubic boron nitride depleted of its catalyst, and combinations thereof.

6. The assembly of claim 1 , wherein the sealant barrier comprises a material selected from the group consisting of a stop off compound, a solder/braze stop, a mask, a tape, a plate, and sealant flow control, or a combination thereof.

7. The assembly of claim 1 , wherein the sealant is bonded to the cap, the first or second lid, the can, or a combination thereof.

8. The assembly of claim 1 , wherein the sealant begins to flow at a temperature at least equal to or greater than the temperature required to at least partially cleanse the assembly.

9. The assembly of claim 1 , wherein the sealant at least partially melts at a temperature about equal to or greater that the temperature required to at least partially cleanse the assembly.

10. The assembly of claim 1 , wherein the sealant comprises a material selected from the group consisting of copper, nickel, cobalt, gold, silver, manganese, palladium, titanium, niobium, zinc, phosphorus, boron, aluminum, cadmium, chromium, tin, silicon, tantalum, alloys, compounds mixtures, and combinations thereof having a melting point, or melting range, at least partially higher than the temperature required to cleanse the assembly.

11. The assembly of claim 1 , wherein the meltable sealant comprises a melting temperature of 1000° C. to 2000° C.

12. The assembly of claim 1 , wherein the can and or first lid comprise a metal or metal alloy portion.