IP Library Granted Patent US 7,695,891
Granted Patent B2
US 7,695,891 · App. 11/471,713 · Granted Apr 13, 2010

Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition

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Quick Facts
Patent No.
US 7,695,891
App. No.
11/471,713
Granted
Apr 13, 2010
Kind
B2
Abstract

A photosensitive composition comprising a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation; a pattern forming method using the photosensitive composition; a compound having a specific structure; and a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation.

Claims (74)

1. A photosensitive composition for exposure with an ArF excimer laser comprising:

(A) a compound capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation:

A-R—X—F  (I)

wherein X represents —CO— or —SO 2 —;

R represents a fluorine atom-containing divalent linking group;

A represents an acidic group; and

(C) a resin having a group capable of decomposing under the action of an acid to increase a solubility of resin (C) in alkali developer;

wherein the compound (A) capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation is a sulfonium salt compound of the compound represented by formula (I) or an iodonium salt compound of the compound represented by formula (I);

the acidic group of A in formula (I) is —SO 3 H, —CO 2 H or —X—NH—X—R 1 , wherein X represents —CO— or —SO 2 —, and a plurality of X's may be the same or different; R 1 represents a monovalent organic group and the resin (C) has no aromatic group.

2. A pattern forming method comprising:

forming a photosensitive film from a photosensitive composition according to claim 1 ; and

exposing and developing the photosensitive film.

3. The photosensitive composition according to claim 1 , which further comprises (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation.

4. The photosensitive composition according to claim 3 ,

wherein the compound as the component (B) is a sulfonium salt of fluoro-substituted alkanesulfonic acid, fluorine-substituted benzenesulfonic acid or fluorine-substituted imide acid.

5. The photosensitive composition according to claim 1 ,

wherein the resin as the component (C) has a fluorine atom in a main or side chain.

6. The photosensitive composition according to claim 5 ,

wherein the resin as the component (C) has a hexafluoroisopropanol structure.

7. The photosensitive composition according to claim 1 ,

wherein the resin as the component (C) has at least one repeating unit selected from 2-alkyl-2-adamantyl (meth)acrylate and dialkyl(1-adamantyl)methyl (meth)acrylate.

8. The photosensitive composition according to claim 1 ,

wherein the resin as the component (C) has a monocyclic or polycyclic alicyclic hydrocarbon structure.

9. The photosensitive composition according to claim 8 ,

wherein the resin as the component (C) has at least one repeating unit selected from 2-alkyl-2-adamantyl (meth)acrylate and dialkyl(1-adamantyl)methyl (meth)acrylate, at least one repeating unit having a lactone structure and at least one repeating unit having a hydroxyl group.

10. The photosensitive composition according to claim 9 ,

wherein the resin as the component (C) further has a repeating unit having a carboxyl group.

11. The photosensitive composition according to claim 1 ,

wherein the resin as the component (C) has a silicon atom in a main or side chain.

12. The photosensitive composition according to claim 1 ,

wherein the resin as the component (C) has a repeating unit having a lactone structure.

13. The photosensitive composition according to claim 1 , which further comprises at least one of (G) a basic compound and (H) at least one of a fluorine-containing surfactant and a silicon-containing surfactant.

14. The photosensitive composition according to claim 13 ,

wherein the basic compound (G) is a compound having a structure selected from an imidazole structure, a diazabicyclo structure, an onium hydroxide structure, an onium carboxylate structure, a trialkylamine structure, an aniline structure and a pyridine structure, an alkylamine derivative having at least one of a hydroxyl group and an ether bond or an aniline derivative having at least one of a hydroxyl group and an ether bond.

15. The photosensitive composition according to claim 1 , wherein the divalent linking group represented by R in formula (I) is a fluorine atom-containing divalent linking group having a carbon number of 1 to 8.

16. The photosensitive composition according to claim 1 , wherein the fluorine atom-containing divalent linking group represented by R in Formula (I) is a fluorine atom-containing alkylene group or a fluorine atom-containing phenylene group.

17. The photosensitive composition according to claim 1 , wherein R 1 represents as alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group and wherein each R 1 group optionally has a substituent.

18. A compound represented by formula (A1) or (A2):

wherein R 201 , R 202 and R 203 each independently represents an organic group;

R 204 and R 205 each independently represents an aryl group, an alkyl group or a cycloalkyl group; and

X represents an anion of the compound represented by formula (I)

A-R—X—F  (I)

wherein X represents —CO— or —SO 2 —;

R represents a fluorine atom-containing divalent linking group;

A represents an acidic group;

the acidic group of A in formula (I) is —SO 3 H, —CO 2 H or —X—NH—X—R 1 , wherein X represents —CO— or —SO 2 —, and a plurality of X's may be the same or different and

R 1 represents a monovalent organic group.

19. The compound according to claim 18 , wherein the divalent linking group represented by R in formula (I) is a fluorine atom-containing divalent linking group having a carbon number of 1 to 8.

20. The photosensitive composition according to claim 18 , wherein the fluorine atom-containing divalent linking group represented by R in Formula (I) is a fluorine atom-containing alkylene group or a fluorine atom-containing phenylene group.

21. The compound according to claim 18 , wherein R 1 represents as alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group and wherein each R 1 group optionally has a substituent.

22. A compound (A) capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation:

A-R—X—F  (I)

wherein X represents —CO— or —SO 2 —;

R represents a fluorine atom-containing divalent linking group;

A represents an acidic group;

wherein the compound (A) capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation is a sulfonium salt compound of the compound represented by formula (I) or an iodonium salt compound of the compound represented by formula (I);

the acidic group of A in formula (I) is —SO 3 H, —CO 2 H or —X—NH—X—R 1 , wherein X represents —CO— or —SO 2 —, and a plurality of X's may be the same or different; and

R 1 represents a monovalent organic group.

23. The compound according to claim 22 , wherein the divalent linking group represented by R in formula (I) is a fluorine atom-containing divalent linking group having a carbon number of 1 to 8.

24. The photosensitive composition according to claim 22 , wherein the fluorine atom-containing divalent linking group represented by R in Formula (I) is a fluorine atom-containing alkylene group or a fluorine atom-containing phenylene group.

25. The compound according to claim 22 , wherein R 1 represents as alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group and wherein each R 1 group optionally has a substituent.

26. A negative photosensitive composition comprising:

(A) a compound capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation:

A-R—X—F  (I)

wherein X represents —CO— or —SO 2 —;

R represents a fluorine atom-containing divalent linking group;

A represents an acidic group;

(B) a resin soluble in an alkali developer; and

(F) an acid crosslinking agent capable of crosslinking with the resin soluble in an alkali developer under an action of an acid;

wherein the compound (A) capable of generating a compound represented by formula (I) upon irradiation with actinic rays or radiation is a sulfonium salt compound of the compound represented by formula (I) or an iodonium salt compound of the compound represented by formula (I);

the acidic group of A in formula (I) is —SO 3 H, —CO 2 H or —X—NH—X—R 1 , wherein X represents —CO— or —SO 2 —, and a plurality of X's may be the same or different; and

R 1 represents a monovalent organic group.

27. The photosensitive composition according to claim 26 , wherein the fluorine atom-containing divalent linking group represented by R in Formula (I) is a fluorine atom-containing alkylene group or a fluorine atom-containing phenylene group.

28. The negative photosensitive composition according to claim 26 , wherein R 1 represents as alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group and wherein each R 1 group optionally has a substituent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →