Semiconductor device
View Patent ↗In a semiconductor device provided with terminals for external connection, input terminals, power supply terminals and ground terminals are disposed close together on part of one edge portion of two opposing edge portions. Output terminals are disposed in the vicinity of both ends of the one edge portion and on another edge portion of the two edge portions. A ground wiring is routed from the other edge portion and connected to the ground terminals. In so doing, elemental devices connected to the input terminals are disposed close together, whereby needless gaps do not arise between the elemental devices. A ground potential is also supplied by the ground wiring.
1. A plasma display module comprising:
an address driver integrated circuit (IC) having opposing first and second edge portions, the IC including;
input terminals;
power supply terminals;
ground terminals;
a peripheral ground wiring;
a central ground wiring; and
output terminals;
wherein the power supply terminals, the ground terminals and the input terminals are disposed only on the first edge portion, and the output terminals are disposed on the first and second edge portions,
first and second ends of the peripheral ground wiring are routed to the first edge portion, a first end of the central ground wiring is routed to the first edge portion, and a second end of the central ground wiring is routed to a center of the peripheral ground wiring.
2. The plasma display module of claim 1 , wherein the first edge portion has two opposite ends and the output terminals are disposed in a vicinity of each of the opposite ends.
3. The plasma display module of claim 1 , wherein the input terminals are disposed between the output terminals.
4. The plasma display module of claim 2 , further comprising a high-voltage circuit, wherein the ground wiring is disposed over the high-voltage circuit and supplied a voltage from at least one of the ground terminals and the power supply terminals.
5. The plasma display module of claim 1 , further comprising a power supply wiring routed to the first edge portion.
6. The plasma display module of claim 5 , further comprising a high-voltage circuit, wherein the power supply wiring is disposed over the high-voltage circuit and supplied a voltage from at least one of the ground terminals and the power supply terminals.
7. The plasma display module of claim 1 , further comprising a Tape Carrier Package (TCP), wherein the IC is mounted on the TCP.
8. The plasma display module of claim 1 , wherein the central ground wiring is disposed between the input terminals.
9. The plasma display module of claim 1 , wherein at least two of a peripheral power supply wiring, the peripheral ground wiring, a logic power supply wiring and a logic ground wiring are formed in a same layer.
10. The plasma display module of claim 9 , further comprising an underlying wiring, wherein the logic power supply wiring and the logic ground wiring are connected to the underlying wiring.
11. The plasma display module of claim 1 , further comprising a Tape Carrier Package (TCP) and TCP terminals on the TCP, wherein the TCP terminals include first and second TCP terminals, the first TCP terminals corresponding to the input terminals, the power supply terminals and the ground terminals being disposed on a first edge portion of the TCP, the second TCP terminals corresponding to the output terminals and being disposed on a second edge portion of the TCP.
12. The plasma display module of claim 1 , further comprising:
a plasma display panel including a plurality of address electrodes, the IC applying a voltage to the plurality of address electrodes.