IP Library Granted Patent US 7,429,095
Granted Patent B2
US 7,429,095 · App. 11/472,345 · Granted Sep 30, 2008

Method of assembling modular printhead assembly

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Quick Facts
Patent No.
US 7,429,095
App. No.
11/472,345
Granted
Sep 30, 2008
Kind
B2
Abstract

A method of assembling a modular printhead assembly is provided. The method includes mounting printhead integrated circuits to fluid distribution members, where each printhead IC has nozzles for printing fluid onto print media and the fluid distribution members have apertures for distributing fluid to respective ones of the nozzles, fixedly attaching the fluid distribution members onto a support member with curable resin selectively deposited about fluid delivery channels of the support member and the apertures of the fluid distribution members, where the attachment is made so that the fluid delivery channels are in fluid communication with respective ones of the apertures, and curing the curable resin to seal the selective attachment of the fluid distribution and support members.

Claims (8)

1. A method of assembling a modular printhead assembly comprising the steps of:

mounting a plurality of printhead integrated circuits to a plurality of fluid distribution members, each printhead integrated circuit having nozzles for printing fluid onto the surface of print media and the fluid distribution members having apertures for distributing fluid to the nozzles;

fixedly attaching the fluid distribution members onto a support member with curable resin selectively deposited about fluid delivery channels of the support member and the apertures of the fluid distribution members, the attachment being made so that the fluid delivery channels of the support member are in fluid communication with respective ones of the apertures of the fluid distribution members; and

curing the curable resin to seal the selective attachment of the fluid distribution and support members.

2. A method according to claim 1 , further comprising the step of adhering electrical connectors to each of the fluid distribution members for connecting electrical signals to respective ones of the printhead integrated circuits.

3. A method according to claim 1 , wherein the curable resin is an epoxy resin.

4. A method according to claim 1 , wherein the attaching step includes the step of selectively depositing the curable resin about apertures of the support member which extend to the fluid delivery channels.

5. A method according to claim 4 , wherein the step of curing the curable resin is performed so as to form sealing gaskets about the apertures of the support and fluid distribution members.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028569/0606 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2006
From: SILVERBROOK, KIA; NAKAZAWA, AKIRA
To: SILVRBROOK RESEARCH PTY LTD.
Reel/Frame 018024/0478 →