IP Library Granted Patent US 7,537,464
Granted Patent B2
US 7,537,464 · App. 11/473,647 · Granted May 26, 2009

Electrical pin interconnection for electronic package

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Quick Facts
Patent No.
US 7,537,464
App. No.
11/473,647
Granted
May 26, 2009
Kind
B2
Abstract

An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having electrical circuitry, a shroud, and a plurality of conductive pins. The conductive pins are pressed into contact with contact pads of the electrical circuitry. The electrical connector assembly also includes an overmolding material securing the shroud such that the conductive pins contact the electrical circuitry.

Claims (33)

1. An electrical connector assembly comprising:

a substrate;

electrical circuitry formed on the substrate;

an electrically conductive pin having at least one pointed member in forced contact with the electrical circuitry such that the at least one pointed member penetrates at least a portion of the electrical circuitry; and

an overmolding material disposed on at least a portion of the conductive pin and the substrate for securing the conductive pin such that the pointed member of the conductive pin is held in contact with the electrical circuitry on the substrate.

2. The electrical connector assembly as defined in claim 1 , wherein the electrically conductive pin comprises an elongated shaft having first and second terminal ends, wherein the pointed member is located at the first terminal end.

3. The electrical connector assembly as defined in claim 2 , wherein the conductive pin comprises a plurality of pointed members at the first terminal end.

4. The electrical connector assembly as defined in claim 1 , wherein the assembly comprises a plurality of electrically conductive pins aligned and in contact with the electrical circuitry.

5. The electrical connector assembly as defined in claim 1 further comprising a solder provided on at least one of the electrical circuitry.

6. The electrical connector assembly as defined in claim 1 , wherein the pointed member comprises a barb formed on a shaft of the conductive pin for engaging electrical circuitry in a thru hole.

7. The electrical connector assembly as defined in claim 1 , wherein the conductive pin is connected to a shroud.

8. The electrical connector assembly as defined in claim 1 , wherein the electrical circuitry comprises circuit contact pads formed on a surface of the substrate.

9. The electrical connector assembly as defined in claim 1 , wherein the connection between the conductive pin and electrical circuitry is free of solder.

10. An electrical connector assembly comprising:

a substrate comprising electrical circuitry having a contact pad;

an electrically conductive pin pressed into contact with the contact pad, wherein the conductive pin comprises a pointed member for contacting the contact pad such that the pointed member penetrates at least a portion of the contact pad;

a shroud engaged to the conductive pin; and

an overmolding material disposed at least partially between the shroud and the substrate to the conductive pin in contact with the contact pad.

11. The electrical connector assembly as defined in claim 10 , wherein the contact between the conductive pin and the contact pad is free of solder.

12. The electrical connector assembly as defined in claim 10 , wherein the conductive pin comprises a plurality of pointed members at a first terminal end.

13. The electrical connector assembly as defined in claim 10 further comprising solder disposed on the contact pad.

14. The electrical connector assembly as defined in claim 10 , wherein the pointed member comprises a barb formed on a shaft of the conductive pin for engaging electrical circuitry in a thru hole.

15. The electrical connector assembly as defined in claim 10 , wherein the assembly comprises a plurality of electrically conductive pins aligned and in contact with the contact pads.

16. A method of assembling an electrical connector assembly to contact circuitry on a substrate, said method comprising the steps of:

providing a substrate having electrical circuitry;

disposing an electrical conductive pin on the electrical circuitry, such that a pointed member of the conductive pin is forced to penetrate at least a portion of the electrical circuitry;

forcing the conductive pin into contact with the electrical circuitry; and

applying an overmolding material to the conductive pin and curing the overmolding material to hold the conductive pin such that the conductive pin maintains contact with the electrical circuitry.

17. The method as defined in claim 16 further comprising the step of assembling the conductive pin in a shroud, wherein the shroud is held in place with the substrate to hold the conductive pin in contact with the electrical circuitry.

18. The method as defined in claim 17 , wherein the step of applying the overmolding material comprises applying the overmolding material disposed at least partially between the shroud and the substrate.

19. The method as defined in claim 16 further comprising the step of aligning a plurality of conductive pins with a plurality of contact pads such that each conductive pin is in contact with a contact pad.

20. The method as defined in claim 16 , wherein the pointed member is provided at a terminal end of the conductive pin.

21. The method as defined in claim 16 , wherein the pointed member is a barb on a shaft of the conductive pin extending into a thru hole.

Assignments (8)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
RELEASE OF SECURITY INTEREST Recorded Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
SECURITY AGREEMENT Recorded Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC; DELPHI CONNECTION SYSTEMS LLC; DELPHI CORPORATION; DELPHI HOLDINGS LLC; DELPHI INTERNATIONAL SERVICES COMPANY LLC; DELPHI MEDICAL SYSTEMS LLC; DELPHI TRADE MANAGEMENT LLC
Reel/Frame 026138/0574 →
SECURITY AGREEMENT Recorded Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2006
From: WHITCUP, SCOTT M.; ROBINSON, MICHAEL R.
To: ALLERGAN, INC.
Reel/Frame 018125/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2006
From: BRANDENBURG, SCOTT D.; DEGENKOLB, THOMAS A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 018036/0691 →