Cooling device and electronic apparatus
View Patent ↗According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the heat-receiving section. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section is formed on one of the first and second plate members.
1. A cooling device comprising:
a heat transfer unit including a passage, through which a coolant circulates in a first direction, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,
wherein the heat transfer unit comprises a first plate member, in which a groove corresponding to the passage is formed, a plurality of protrusions formed over a sidewall of the groove and each of the plurality of protrusions inclined so as to form an obtuse angle between the sidewall and a surface of the protrusions in contact with the coolant flowing the first direction, and a second plate member, which covers the groove, and
the heat-receiving section is formed on one of the first and second plate members.
2. The cooling device according to claim 1 , further comprising a pump having an inlet port and a discharge port,
wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.
3. The cooling device according to claim 1 , wherein a second groove corresponding to the passage is formed in the second plate member.
4. The cooling device according to claim 1 , wherein the groove comprises a plurality of grooves extending in parallel with each other.
5. The cooling device according to claim 1 , wherein the groove extends across the heat-receiving section, the groove comprises a plurality of grooves extending in parallel with one another from the heat-receiving section to the heat-sinking section.
6. The cooling device according to claim 1 , wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.
7. The cooling device according to claim 1 , wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.
8. The cooling device according to claim 1 , wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating element, and
the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members, the partition wall sections connecting to one of the first and second plate members.
9. An electronic apparatus comprising:
a casing;
a heating element housed in the casing; and
a cooling device that cools the heating element, the cooling device comprising:
a heat transfer unit including a passage, through which a coolant circulates in a first direction, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,
wherein the heat transfer unit comprises:
a first plate member, in which a groove corresponding to the passage is formed, a plurality are formed over a sidewall of the groove and each of the plurality of protrusions is inclined so as to form an obtuse angle between the sidewall and a surface of the protrusion in contact with the coolant flowing in the first direction,
a second plate member, which covers the groove, and
the heat-receiving section is formed on one of the first and second plate members.
10. The electronic apparatus according to claim 9 , further comprising a pump having an inlet port and a discharge port,
wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.
11. The electronic apparatus according to claim 9 , wherein a second groove corresponding to the passage is formed in the second plate member.
12. The electronic apparatus according to claim 9 , wherein the groove comprises a plurality of grooves extending in parallel with each other.
13. The electronic apparatus according to claim 9 , wherein the groove extends across the heat-receiving section, the groove comprises a plurality of grooves extending in parallel with one another from the heat-receiving section to the heat-sinking section.
14. The electronic apparatus according to claim 9 , wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.
15. The electronic apparatus according to claim 9 , wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.
16. The electronic apparatus according to claim 9 , wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating elements, and
the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members, the partition wall sections connecting to one of the first and second plate members.