Flat panel display and method for manufacturing the same

1. A method for manufacturing a flat panel display comprising:

preparing a lower glass substrate;

forming an array having metal lines crossing each other on the lower glass substrate;

depositing glass powder over the lower glass substrate including the array; and

melting the glass powder by heating the lower glass substrate, and hardening the molten glass powder at room temperature, to form a glass film made of the glass powder,

wherein the glass film is used as an upper glass substrate and

wherein the glass powder consists of ZnO, SiO 2 , and BaO particles, and a binder and wherein the particles have a size ranging from 1 μm to 10 μm.

2. The method as set forth in claim 1 , wherein the deposition of the glass powder is performed by use of a dispenser.

3. The method as set forth in claim 1 , wherein the lower glass substrate is heated to a temperature ranging from about 300 to 500 degrees Celsius for about 5 to 30 minutes.

4. A method for manufacturing a flat panel display, comprising:

forming a plurality of gate lines on a lower glass substrate in a direction, the gate lines having a plurality of gate electrodes;

forming a gate insulation film over the lower glass substrate including the gate lines;

forming a semiconductor layer on the gate insulation film at positions corresponding to the gate electrodes therebelow;

forming a plurality of data lines perpendicular to the gate lines to define pixel regions, and forming a plurality of source electrodes protruded from the data lines and a plurality of drain electrodes spaced apart from the source electrodes;

forming an interlayer insulation film on the gate insulation film, including the data lines;

forming contact holes by selectively removing the gate insulation film, to expose portions of the drain electrodes;

filling up the contact holes and forming a plurality of anodes on the pixel regions;

forming a plurality of partitions on the interlayer insulation film at regions except for the pixel regions;

forming a plurality of organic matter layers between the partitions to emit light;

forming a cathode over the lower glass substrate, including the partitions and the organic matter layers;

forming a protective film on the cathode;

depositing glass powder over the protective film, entirely; and

sintering the glass powder to form a glass film,

wherein the glass film is used as an upper glass substrate and

wherein the glass powder consists of ZnO, SiO 2 , and BaO particles, and a binder and wherein the particles have a size ranging from 1 μm to 10 μm.

5. The method as set forth in claim 4 , wherein the deposition of the glass powder is performed by a dispenser.

6. The method as set forth in claim 4 , wherein the sintering of the glass powder is performed by heating the lower glass substrate at a temperature ranging from about 300 to 500 degrees Celsius for about 5 to 30 minutes to melt the glass powder, and hardening the molten glass powder.