Singulated dies in a parallel optics module
View Patent ↗A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.
1. A system, comprising:
a printed circuit board;
a parallel optics module coupled to the printed circuit board, the parallel optics module including:
a substrate;
two or more dies attached to the substrate, wherein each die includes a single semiconductor optical component, wherein the two or more dies are attached to the substrate with an alignment tolerance between approximately 5 microns and approximately 20 microns; and
two or more optical fibers corresponding to the two or more dies optically aligned with the two or more dies; wherein the parallel optics module operates with optical signals having a transmission data rate of approximately 3-4 Gigabits per second (Gb/s) per channel.
2. The system of claim 1 wherein the two or more optical fibers include at least one plastic optical fiber.
3. The system of claim 1 wherein the single semiconductor optical component includes one of an optical transmitter and an optical receiver.
4. The system of claim 1 , further comprising an optical connector coupled to the parallel optics module, the optical connector coupled to a fiber optic ribbon.
5. The system of claim 1 , further comprising:
a processor communicatively coupled to the parallel optics module; and
a storage component communicatively coupled to the parallel optics module.
6. The system of claim 1 wherein the system is one of a network element and a computer system.