Method and apparatus of fabricating liquid crystal display device
View Patent ↗A method and an apparatus of fabricating a liquid crystal display device adapted to improve a lift-off efficiency are disclosed. The liquid crystal display device is also disclosed. The method includes forming a first thin film on a substrate; forming a photo-resist pattern on the first thin film; etching the first thin film using the photo-resist pattern as a mask; forming a second thin film on the substrate having the photo-resist pattern; forming a plurality of stripper infiltration paths; and removing the photo-resist pattern and the second thin film using a stripper within the stripper infiltration paths. The device includes two substrates facing each other; a liquid crystal layer; data lines and gate lines that cross each other to define pixel regions; thin film transistors; pixel electrodes connected to the thin film transistors; and an inorganic layer in each pixel region, wherein the inorganic layer includes a plurality of cracks.
1. A method of fabricating a liquid crystal display device, comprising:
forming a first thin film on a substrate;
forming a photo-resist pattern on the first thin film;
etching the first thin film using the photo-resist pattern as a mask;
forming a second thin film on the substrate having the photo-resist pattern;
forming a plurality of stripper infiltration paths in the second thin film; and
removing the photo-resist pattern and the second thin film using a stripper within the stripper infiltration paths,
wherein forming a plurality of stripper infiltration paths in the second thin film includes performing a heat treatment process,
wherein forming the plurality of stripper infiltration paths further includes baking the photo-resist pattern and wherein a temperature of baking is set under a temperature of the heat treatment process,
wherein the temperature of baking is approximately 80° C.-120° C.,
wherein the temperature of the heat treatment process is approximately 120° C.-200° C.,
wherein the second thin film is a transparent conductive layer.
2. The method of claim 1 , wherein the photo-resist pattern is formed of an organic material.
3. The method of claim 1 , wherein the first thin film is an insulating film.
4. The method of claim 1 , wherein the heat treatment process includes at least one of a heating method and a light energy irradiating method.
5. The method of claim 4 , wherein the heating method includes an infrared heating method.
6. The method of claim 1 , wherein removing the photo-resist pattern and the second thin film uses a lift-off process.