IP Library Granted Patent US 8,068,097
Granted Patent B2
US 8,068,097 · App. 11/477,179 · Granted Nov 29, 2011

Apparatus for detecting conductive material of a pad layer of a sensing device

Assignee: Cypress Semiconductor Corporation
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Quick Facts
Patent No.
US 8,068,097
App. No.
11/477,179
Filed
Jun 27, 2006
Granted
Nov 29, 2011
Kind
B2
Examiner
ZHOU, HONG
Art Unit
2629
USPC
345/156
Abstract

An apparatus and method for distinguishing a particular button operation from among multiple button operations on a sensing device having multiple sensor elements that are electrically coupled together. The apparatus may include a sensing device having a first sensor element and a second element that are electrically coupled to detect a presence of a conductive object on the sensing device. The method may include detecting a presence of a conductive object on a sensing device having multiple sensor elements that are electrically coupled, each sensor element corresponding to a button operation, and distinguishing between the multiple button operations.

Claims (16)

1. An apparatus, comprising:

a sensing device having a plurality of sensor elements that are electrically coupled to detect a presence of a conductive object on the sensing device, wherein the plurality of sensor elements correspond to a plurality of button operations;

a keyboard coupled to the sensing device, wherein the keyboard comprises a plurality of keys that correspond to the plurality of sensor elements; and

a processing device coupled to the sensing device to distinguish a particular button operation from among the plurality of button operations when a particular key of the plurality of keys of the keyboard is pressed, wherein the sensing device comprises:

a routing layer comprising the plurality of sensor elements, wherein the routing layer is coupled to the processing device;

a pad layer comprising conductive material in button areas that corresponds to the plurality of keys and the plurality of sensor elements, wherein each of the button areas is configured to operate as the conductive object that is detected by the routing layer when the particular key is pressed, wherein the processing device is configured to measure capacitances on the plurality of sensor elements to detect the presence of the conductive object when one of the plurality of keys is pressed, and wherein the pad layer does not directly contact the routing layer when the particular key is pressed; and

an insulating layer configured to electrically isolate the pad layer and the routing layer when the processing device measures the capacitances, wherein the insulating layer is disposed between the routing layer and the pad layer.

2. The apparatus of claim 1 , further comprising a plastic film layer coupled between the plurality of keys and the pad layer of the sensing device.

3. The apparatus of claim 2 , wherein the plastic film layer is configured to evenly distribute a force applied to one of the plurality of keys being pressed to the corresponding button areas of the pad layer.

4. The apparatus of claim 1 , wherein a first key of the plurality of keys has a larger corresponding conductive material than a second key of the plurality of keys.

5. The apparatus of claim 4 , wherein the processing device is configured to recognize that the first key has been pressed when the presence of the corresponding conductive material of the pad layer is detected on a first sensor element of the plurality of sensor elements in the routing layer, and to recognize that the second key has been pressed when the presence of the corresponding conductive material of that pad layer is detected on a second sensor element of the plurality of sensor elements in the routing layer.

6. The apparatus of claim 1 , wherein a first sensor element of the plurality of sensor elements in the routing layer comprises a first sensitivity and a second sensor element of the plurality of sensor elements in the routing layer comprises a second sensitivity, wherein the first sensitivity is greater than the second sensitivity, and wherein the processing device is configured to distinguish the particular key that has been pressed based on the first sensitivity of the first sensor element and the second sensitivity of the second sensor element.

7. The apparatus of claim 6 , wherein the first and second sensor elements are electrically coupled.

8. The apparatus of claim 6 , wherein the first and second sensor elements are coupled to the processing device using one pin.

9. The apparatus of claim 1 , wherein the processing device is configured to determine a capacitance on the sensing device, and wherein processing device is configured to recognize that a first key of the plurality of keys is pressed when the capacitance is greater than a first sensitivity threshold and that a second key of the plurality of plurality of keys is pressed when the capacitance is less than the first sensitivity threshold and greater than a second sensitivity threshold.

10. The apparatus of claim 9 , wherein the first and second sensitivity thresholds are greater than a presence threshold, wherein the presence threshold is configured to indicate the detected presence of the conductive object by the routing layer.

Assignments (7)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: SPANSION LLC; CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
PATENT SECURITY AGREEMENT Recorded Aug 28, 2012
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 028863/0870 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2006
From: GUANGHAI, LI
To: CYPRESS SEMICONDUCTOR CORPORATEION
Reel/Frame 018058/0250 →
Continuity (1)
Related Publication 20070296709A1 · Dec 27, 2007