Deposition method using a uniform electric field

1. A deposition method, comprising the steps of:

placing a substrate on a susceptor inside a chamber, the susceptor including a center pin passing through the susceptor for lifting the substrate up and down;

applying a first voltage source to the susceptor;

electrically connecting a connection member extending along and attached to an entire axial length of the center pin to the first voltage source;

applying a second voltage source to a counter electrode to generate a uniform electric field between the counter electrode and the substrate; and

forming a film on the substrate by chemical vapor deposition.

2. The method according to claim 1 , wherein placing of the substrate includes positioning the substrate in contact with a head portion of the center pin, the head portion being supported by a head supporter.

3. The method according to claim 2 , wherein the connection member is formed between the head portion and the head supporter.

4. The method according to claim 2 , wherein the connection member passes through a center portion of the head supporter.

5. The method according to claim 2 , wherein the connection member is formed along one side of the head supporter.

6. The method according to claim 2 , wherein the head portion includes aluminum.

7. The method according to claim 2 , wherein the head supporter includes a ceramic material.

8. The method according to claim 2 , wherein the head portion is formed with a conductive material, and the head supporter is formed with a material having a low coefficient of thermal expansion.

9. The method according to claim 2 , wherein the head portion is coated with an insulating material.

10. The method according to claim 1 , wherein the connection member includes an electrically conductive metal.

11. The method according to claim 1 , further comprising heating the substrate.

12. The method according to claim 11 , wherein heating the substrate includes energizing a heating coil within the susceptor.