IP Library Granted Patent US 7,659,577
Granted Patent B2
US 7,659,577 · App. 11/477,691 · Granted Feb 9, 2010

Power semiconductor device with current sense capability

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,659,577
App. No.
11/477,691
Granted
Feb 9, 2010
Kind
B2
Abstract

A power semiconductor device includes a power device and a current sense device formed in a common semiconductor region.

Claims (38)

1. A power semiconductor device comprising:

a power device formed in a semiconductor region of one conductivity;

a current sense device formed in said semiconductor region, said current sense device including,

a plurality of active cells each including a base region of another conductivity formed in said semiconductor region, and a conductive region of said one conductivity formed in each said base region spaced from said semiconductor region of said one conductivity by an invertible region of said another conductivity;

a transistor gate adjacent said invertible region;

a plurality inactive cells of said another conductivity disposed at the outer boundary of said active region; and

a first power electrode in electrical contact with said conductive region of said one conductivity;

wherein said transistor gate extends over at least a portion of a respective inactive cell, said transistor gate including a gate electrode which is shorted to said first power electrode, wherein said active cells are a plurality of spaced stripes arranged in a row and said inactive cells include a first stripe shaped region of said another conductivity adjacent a first one of said active cells and a second stripe shaped region adjacent a last one of said active cells.

2. The power semiconductor device of claim 1 , wherein said power device is a MOSFET.

3. The power semiconductor device of claim 1 , wherein said power device is an IGBT.

4. The power semiconductor device of claim 1 , wherein a conductive region of said one conductivity are source regions.

5. The power semiconductor device of claim 1 , wherein said transistor gate extends over at least a portion of a respective inactive cell, said transistor gate including a gate electrode having a conductivity as said inactive cell.

6. A power semiconductor device comprising:

a power device formed in a semiconductor region of one conductivity;

a current sense device formed in said semiconductor region, said current sense device including,

an active region having a plurality of active cells, each active cell including a base region of another conductivity formed in said semiconductor region, and a conductive region of said one conductivity formed in each said base region spaced from said semiconductor region of said one conductivity by an invertible region of said another conductivity;

a transistor gate adjacent said invertible region; and

a plurality of inactive cells of said another conductivity disposed at the outer boundary of said active region;

wherein said active cells are a plurality of spaced stripes arranged in a row and said inactive cells include a first stripe shaped region of said another conductivity adjacent a first one of said active cells and a second stripe shaped region adjacent a last one of said active cells.

7. The power semiconductor device of claim 6 , wherein said power device is a MOSFET.

8. The power semiconductor device of claim 6 , wherein said power device is an IGBT.

9. The power semiconductor device of claim 6 , wherein said invertible region is horizontally oriented.

10. The power semiconductor device of claim 6 , wherein said conductive region of said one conductivity is a source region.

11. The power semiconductor device of claim 6 , further comprising a semiconductor substrate of said one conductivity, said semiconductor region being disposed on said semiconductor substrate and further comprising a second power electrode in electrical contact with said substrate.

12. The power semiconductor device of claim 11 , wherein said first power electrode is a source sense electrode and said second power electrode is a drain electrode of said power device and said current sense device.

13. The power semiconductor device of claim 6 , wherein said semiconductor region serves as a common conduction region for said power device and said current sense device.

14. The power semiconductor device of claim 6 , wherein said transistor gate extends over at least a portion of a respective inactive cell, said transistor gate including a gate electrode having a same conductivity as said inactive cell.

15. The power semiconductor device of claim 6 , wherein at least one of said inactive cells is shorted to an active cell through a region of said another conductivity.

16. A power semiconductor device comprising:

a power device formed in a semiconductor region of one conductivity;

a current sense device including an active region having a plurality of active cells, each active cell including a base region of an opposite conductivity formed in said semiconductor region, and a conductive region of said one conductivity formed in each said base region spaced apart by an invertible region of said opposite conductivity;

a transistor gate adjacent said invertible region; and

a plurality of inactive cells of said opposite conductivity disposed in said active region;

wherein said active cells are a plurality of spaced stripes arranged in a row and said inactive cells include a first stripe shaped region of said opposite conductivity.

17. The power semiconductor device of claim 16 , wherein said power device is a MOSFET.

18. The power semiconductor device of claim 16 , wherein said power device is an IGBT.

19. The power semiconductor device of claim 16 , wherein said invertible region is horizontally oriented.

20. The power semiconductor device of claim 16 , wherein said conductive region of said one conductivity is a source region.

Assignments (2)
CHANGE OF NAME Recorded Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2006
From: THIERY, VINCENT
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 018363/0814 →