Semiconductor package
View Patent ↗A semiconductor package including a semiconductor chip; a base member on which the semiconductor chip is mounted; a plurality of leads formed on the base member, the leads including inner ends electrically connected to the semiconductor chip and outer ends; and an index for identifying locations of specific leads.
1. A semiconductor device, comprising:
a semiconductor chip having a plurality of pads on a main surface;
a base member having a main surface on which the semiconductor chip is mounted;
a plurality of first and second leads on the main surface of the base member, first ends of the first and second leads are electrically connected to the pads; and
index numbers on the main surface of the base member adjacent only to the first ends of the first leads, and the first leads are longer than the second leads.
2. The semiconductor device according to claim 1 , wherein the index numbers are different from each other.
3. The semiconductor device according to claim 1 , wherein the index numbers are conductive material.
4. The semiconductor device according to claim 3 , wherein the conductive material of the index numbers is the same as conductive material of the first and second leads.
5. The semiconductor device according to claim 1 , wherein the base member is a polyimide tape.
6. The semiconductor device according to claim 1 , wherein the second leads are placed between the first leads, and a same number of the second leads are placed between each pair of the first leads.
7. The semiconductor device according to claim 6 , wherein the first and second leads extend over the main surface of the semiconductor chip and the first ends are positioned across respective ones of the pads, and
wherein a distance from an edge of the pads to the first ends of the first leads is greater than a distance from an edge of the pads to the first ends of the second leads.
8. The semiconductor device of claim 1 , wherein the main surface of the semiconductor chip faces the surface of the base member.
9. A semiconductor device comprising:
a base member having a first surface and a second surface opposite the first surface;
a plurality of first leads and a plurality of second leads on the first surface of the base member;
index numbers on the first surface of the base member directly adjacent to first ends of the first leads; and
a semiconductor chip on the first surface of the base member directly over the first and second leads and the index numbers, and electrically connected to the first and second leads,
wherein the base member is at least partially transparent so that the index numbers and the first and second leads are visible from the second surface of the base member.
10. The semiconductor device according to claim 9 , wherein the index numbers are different from each other.
11. The semiconductor device according to claim 9 , wherein the index numbers are a conductive material.
12. The semiconductor device according to claim 11 , wherein the first and second leads are a same conductive material as the conductive material of the index numbers.
13. The semiconductor device according to claim 9 , wherein the base member is a polyimide film.
14. The semiconductor device according to claim 9 , wherein the first leads are respectively spaced apart from each other with a same number of the second leads placed between each pair of the first leads.
15. The semiconductor device according to claim 14 , wherein the second leads have first ends, the semiconductor chip has a main surface with a plurality of pads thereon, and the first ends of the first and second leads are connected to the pads and extend inwardly from the pads toward a center of the semiconductor chip,
wherein the first ends of the first leads extend inwardly from the pads further than the first ends of the second leads.
16. The semiconductor device according to claim 9 , wherein the second leads have first ends, the semiconductor chip has a main surface with a plurality of pads thereon, and the first ends of the first and second leads are connected to the pads and extend inwardly from the pads toward a center of the semiconductor chip,
wherein the first ends of the first leads extend inwardly from the pads further than the first ends of the second leads.
17. The semiconductor device of claim 9 , wherein the semiconductor chip includes a main surface having a plurality of pads that are electrically connected to the first and second leads, and the main surface of the semiconductor chip faces the first surface of the base member.