IP Library Granted Patent US 7,293,999
Granted Patent B2
US 7,293,999 · App. 11/479,474 · Granted Nov 13, 2007

Housing of circuit boards

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,293,999
App. No.
11/479,474
Granted
Nov 13, 2007
Kind
B2
Abstract

A fiber optic module has a PCB with high frequency tracks. The PCB is housed within a housing having top and bottom parts, each having a series of metallized ridges. The PBC has through holes filled with solder. Thus, there is a series of electrical interconnections through the PBC, and the total length of any enclosed periphery is much shorter than the full periphery of the board so that high frequencies are attenuated.

Claims (12)

1. An electronic device comprising a circuit board having high frequency tracks and a housing surrounding the board, wherein the housing and the board comprise interconnect means for forming electrical connections between opposed parts of the housing through the board,

wherein the interconnect means comprises conductors extending through the board for contact with the housing on opposed sides of the board, and

wherein the conductors comprise solder filled into board through-holes.

2. An electronic device as claimed in claim 1 , wherein the conductors extend above the surface of the board on at least one side.

3. An electronic device as claimed in claim 2 , wherein the conductors form bumps on both opposed surfaces of the board.

4. An electronic device as claimed in claim 1 , wherein the housing comprises protruding features to make electrical connections with the conductors.

5. An electronic device as claimed in claim 4 , wherein the protruding features are ridge-shaped.

6. An electronic device as claimed in claim 1 , wherein the board comprises through-holes and the housing comprises teeth extending through the through holes.

7. An electronic device as claimed in claim 6 , wherein opposed teeth extend partially through the through-holes to make contact.

8. An electronic device as claimed in claim 7 , wherein the opposed teeth extend partially through the board.

9. An electronic device as claimed in claim 1 , wherein the housing comprises a conductive and resilient connector that makes the contact with the conductors.

10. An electronic device as claimed in claim 9 , wherein said connector is in the form of a gasket surrounding the board.

Assignments (6)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2007
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 019401/0251 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2006
From: EVERETT, KEITH; LITTLE, KEVIN PAUL; ANDERSON, JAMIE
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 018443/0777 →