Optoelectronic assembly with heat sink
An optoelectronic assembly having a heat sink, and in particular to an optical receiver or transmitter unit for use in an optical fibre communication system in which a heat sink is provided to carry away heat generated by electrical components within the unit. The optoelectronic assembly comprises an optical transceiver unit, a heat sink and a housing. The optical transceiver unit has an interior containing at least one optoelectronic device with at least one electrical connection to said device for providing electrical power to the device, the electrical connection being made through an electrical contact on an external surface of the optical transceiver unit. The heat sink is mounted to the optical transceiver unit and is in thermal contact with both the optical transceiver unit and the housing to convey waste heat from within the optical transceiver unit to the housing. The heat sink has at least one conductive electrical path, the path extending between the electrical contact on the external surface of the transceiver unit to a connection terminal by which electrical power may be supplied to the optoelectronic device.
1 . An optoelectronic assembly, comprising an optical transceiver unit, a heat sink and a housing, in which:
the optical transceiver unit is housed within the housing;
the optical transceiver unit has an interior containing at least one optoelectronic device with at least one electrical connection to said device for providing electrical power to said device with at least one electrical connection to said device for providing electrical power to said device, the electrical connection being made through an electrical contact on an external surface of the optical transceiver unit;
the heat sink is mounted to the optical transceiver unit and is in thermal contact with both the optical transceiver unit and the housing to convey waste heat from within the optical transceiver unit to the housing;
the heat sink has at least one conductive electrical path, said path extending between said electrical contact on the external surface of the transceiver to a connection terminal by which electrical power may be supplied to said optoelectronic device.
2 . An optoelectronic assembly as claimed in claim 1 , comprising a circuit substrate, the optoelectronic device being mounted on one side of the circuit substrate, said electrical connection being made on an opposite side of said circuit substrate.
3 . An optoelectronic assembly as claimed in claim 1 , in which the electrical connection between the electrical contact of the optical transceiver unit and the electrical path of the heat sink is made at an interface formed by the mounting of the heat sink to the optical transceiver unit.
4 . An optoelectronic assembly as claimed in claim 1 , comprising a circuit substrate, said substrate having one side that is internal to the optical transceiver unit and an opposite side that that is external to the optical transceiver unit, the heat sink being mounted directly to said opposite side of said circuit substrates.
5 . An optoelectronic assembly as claimed in claim 1 , in which the heat sink when mounted to the optical transceiver unit conceals the electrical connection between the electrical contact of the optical transceiver unit and the electrical path of the heat sink.
6 . An optoelectronic assembly as claimed in claim 1 , in which the connection terminal is separate from points of contact between the heat sink, the optical transceiver unit and the housing.
7 . An optoelectronic assembly as claimed in claim 1 , in which the connection terminal is on an exposed surface of the heat sink.
8 . An optoelectronic assembly as claimed in claim 1 , in which the electrical path extends at least partially along one or more external surfaces of the heat sink.
9 . An optoelectronic assembly as claimed in claim 8 , in which the electrical path extends through a body of the heat sink.
10 . An optoelectronic assembly as claimed in claim 1 , in which the heat sink is in direct contact with the housing.
11 . A method of forming an optoelectronic assembly, comprising an optical transceiver unit, a heat sink and a housing, comprising the steps of:
placing at least one optoelectronic device inside the optical transceiver unit;
providing at least one electrical connection from said device to a corresponding electrical contact on an exposed surface of the optical transceiver unit;
providing the heat sink with at least one conductive electrical path;
mounting the heat sink to the optical transceiver unit so that the or each electrical contact is connected electrically to a corresponding electrical path;
placing the optical transceiver unit within the housing so that waste heat generated by consumption of electrical power within the optical transceiver unit is conveyed from within the optical transceiver unit to the housing through the heat sink; and
making at least one electrical connection to the or each optoelectronic device by means of the electrical path(s) and corresponding electrical contacts.
12 . A method as claimed in claim 1 , comprising:
providing the or each electrical path with a corresponding electrical terminal on an exposed surface of the heat sink; and
making said at least one electrical connection to the or each optoelectronic device by means of a corresponding electrical terminal.