IP Library Granted Patent US 7,450,390
Granted Patent B2
US 7,450,390 · App. 11/481,387 · Granted Nov 11, 2008

Programmable power supply

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,450,390
App. No.
11/481,387
Granted
Nov 11, 2008
Kind
B2
Abstract

A progammable power supply for providing a regulated DC output power is disclosed. The power supply provides the output power to any one of a plurality of electronic devices adapted for receiving the output power at an operational voltage or an operational current. The power supply receives a programming signal to maintain the output power at the operational voltage or operational current associated with a particular selected electronic device. Accordingly, by varying the programming signal, the power supply can be programmed to provide output power to any one of several electronic devices having differing input power requirements.

Claims (22)

1. A small form factor power supply, comprising:

a transformer having a low profile magnetic core;

a printed circuit board including components;

a heat sink thermally coupled to the printed circuit board to transfer heat from at least one of the components;

a case connected to the heat sink to transfer heat from the heat sink to the case in order to dissipate the heat generated from the printed circuit board components, the case having openings on one surface to provide air circulation for the small form factor power supply; and a thin layer of material that lies under the openings of the case to protect the printed circuit board from liquids.

2. The small form factor power supply of claim 1 , wherein the case has openings on a second surface to provide additional air circulation for the small form factor power supply.

3. The small form factor power supply of claim 1 , wherein the thin layer of material is plastic and allows heat from the heat sink to be thermally transferred to the case.

4. The small form factor power supply of claim 1 , wherein the thin layer of material is a metal.

5. A small form factor power supply, comprising:

a transformer having a low profile magnetic core;

a printed circuit board having components mounted thereon;

a heat sink thermally coupled to the components mounted on the printed circuit board to transfer heat from the components;

a case enclosing the transformer, the printed circuit board and the heat sink, the case having openings on one surface to provide air circulation for the power supply; and

a thin layer lying inside the case, the thin layer lying under the openings of the case and protecting the printed circuit from damage from liquids.

6. The small form factor power supply of claim 5 , wherein the thin layer is positioned between a bottom surface of the case and the heat sink.

7. The small form factor power supply of claim 5 , wherein a product of a length and a width of the case is less than fourteen square inches.

8. The small form factor power supply of claim 5 , wherein the thin layer is between 1 millimeter and 3 millimeters thick.

9. The small form factor power supply of claim 5 , wherein the thin layer is made of plastic.

10. The small form factor power supply of claim 5 , wherein the heat sink is thermally coupled to a bottom surface of the printed circuit board.

11. The small form factor power supply of claim 10 , wherein another heat sink is thermally coupled to a top surface of the printed circuit board.

12. The small form factor power supply of claim 5 , wherein the heat sink is a layer of conductive material.

13. The small form factor power supply of claim 12 , wherein the layer of conductive material has dimensions at least as large as dimensions of the printed circuit board.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jun 10, 2014
From: ELKHORN PARTNERS LIMITED PARTNERSHIP
To: COMARCO WIRELESS TECHNOLOGIES, INC.
Reel/Frame 033119/0837 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2014
From: LANNI, THOMAS W.
To: COMARCO WIRELESS TECHNOLOGIES, INC.
Reel/Frame 032235/0151 →
RELEASE OF SECURITY INTEREST Recorded Feb 14, 2013
From: BROADWOOD PARTNERS, L.P.
To: COMARCO WIRELESS TECHNOLOGIES, INC.
Reel/Frame 029814/0061 →
SECURITY AGREEMENT Recorded Feb 11, 2013
From: COMARCO WIRELESS TECHNOLOGIES, INC.
To: ELKHORN PARTNERS LIMITED PARTNERSHIP
Reel/Frame 029789/0440 →
SECURITY AGREEMENT Recorded Aug 17, 2012
From: COMARCO WIRELESS TECHNOLOGIES, INC.
To: BROADWOOD PARTNERS, L.P.
Reel/Frame 028802/0051 →
RELEASE Recorded May 25, 2012
From: SILICON VALLEY BANK
To: COMARCO WIRELESS TECHNOLOGIES, INC.
Reel/Frame 028275/0381 →
SECURITY AGREEMENT Recorded Feb 25, 2009
From: COMARCO WIRELESS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 022299/0954 →