Ink jet nozzle assembly with a thermal bend actuator
View Patent ↗An ink jet nozzle assembly for an inkjet printer includes a wafer substrate defining an ink supply passage. A drive circuitry layer is formed on the wafer substrate. A nozzle is formed on the drive circuitry layer and defines an ink chamber in fluid communication with the ink supply passage, a side aperture in fluid communication with the ink chamber and an ink ejection port in fluid communication with the ink chamber. A support extends from the drive circuitry layer. A thermal bend actuator extends from the support, through the side aperture and terminates in a free end within the ink chamber. The actuator includes a first layer having a first co-efficient of thermal expansion, and a second layer deposited on the first layer which has a second co-efficient of thermal expansion. The first layer is coupled to the drive circuitry layer so that, in use, the drive circuitry layer can actuate bending of the thermal bend actuator so as to move the free end and thereby eject ink from the ink ejection port.
1. An ink jet nozzle assembly for an inkjet printer, the nozzle assembly comprising:
a wafer substrate defining an ink supply passage;
a drive circuitry layer formed on the wafer substrate;
a nozzle formed on the drive circuitry layer, and defining an ink chamber in fluid communication with the ink supply passage, a side aperture in fluid communication with the ink chamber and an ink ejection port in fluid communication with the ink chamber;
a support extending from the drive circuitry layer; and
an elongate, cantilevered thermal bend actuator extending from a fixed end of the cantilever at the support, through the side aperture and terminating in a free end of the cantilever within the ink chamber, the actuator comprising a first layer having a first co-efficient of thermal expansion, and a second layer deposited on the first layer which has a second co-efficient of thermal expansion different than said first co-efficient of thermal expansion, the first layer being coupled to the drive circuitry layer so that, in use, the drive circuitry layer can actuate bending of the thermal bend actuator so as to move the free end and thereby eject ink from the ink ejection port.
2. An ink jet nozzle assembly as claimed in claim 1 , wherein the thermal bend actuator comprises a third layer deposited on the second layer so that the second layer is located between the first and third layers, the third layer also having the first co-efficient of thermal expansion.
3. An ink jet nozzle assembly as claimed in claim 2 , wherein the first and third layers comprise titanium nitride or copper nickel alloy material.
4. An ink jet nozzle assembly as claimed in claim 1 , wherein the second layer comprises one of glass, amorphous silicon dioxide and any other like thermal insulating material.
5. An ink jet nozzle assembly as claimed in claim 1 , wherein the free end is an enlarged paddle.
6. An ink jet nozzle assembly as claimed in claim 5 , wherein the paddle defines a raised lip extending along its periphery.
7. An ink jet nozzle assembly as claimed in claim 1 , wherein the nozzle comprises a cylindrical wall that defines the side aperture and a cover that defines the ink ejection port.