IP Library Granted Patent US 8,981,264
Granted Patent B2
US 8,981,264 · App. 11/486,884 · Granted Mar 17, 2015

Solid state switch

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Quick Facts
Patent No.
US 8,981,264
App. No.
11/486,884
Granted
Mar 17, 2015
Kind
B2
Abstract

An intake air heating system for an internal combustion engine is disclosed and includes an electric heater that heats the intake air and a control module that switches a voltage to the electric heater based on a control signal. The control module includes a gate drive module that includes a bootstrap charge pump module and generates a gate drive signal based on the control signal and that is referenced to the voltage. The control module also includes a power module that switches the power to the electric heater based on the gate drive signal.

Claims (32)

1. An intake air heating system for an internal combustion engine, the system comprising:

an electric heater that heats the intake air; and

a control module that switches a first voltage to the electric heater based on a control signal, the control module comprising

a gate drive module that includes a bootstrap charge pump module, the bootstrap charge pump module generating a bootstrap voltage that is greater than the first voltage, the gate drive module generating a gate drive signal based on the control signal and the bootstrap voltage, the gate drive signal being greater than the first voltage; and

a power module that selectively connects the first voltage to the electric heater based on the gate drive signal.

2. The system of claim 1 wherein the control signal is a pulse width modulated (PWM) signal.

3. The system of claim 1 wherein the bootstrap charge pump module provides sufficient charge to drive the power module at 100% duty cycle.

4. The system of claim 1 wherein the power module includes a plurality of transistors that each provide an equal amount of current to the electric heater.

5. The system of claim 4 wherein the transistors are field effect transistors.

6. The system of claim 4 wherein the transistors are insulated gate bipolar transistors.

7. The system of claim 4 wherein each transistor includes a gate that receives the gate drive signal.

8. The system of claim 7 further comprising circuit elements having resistances in series with respective ones of the gates.

9. The system of claim 8 wherein values of the resistances are equal.

10. The system of claim 1 wherein the gate drive module includes

an integrated circuit; and

a printed circuit board that includes a first set of solder pads that accommodate a first package type for the integrated circuit and a second set of solder pads that accommodate a second package type for the integrated circuit.

11. The system of claim 1 wherein the power module is configured as a high-side driver of the electric heater.

12. The system of claim 1 wherein the gate drive module includes a second charge pump module that generates a second voltage regulated to a predetermined voltage level, and wherein the gate drive signal is based on the second voltage and the bootstrap voltage.

13. The system of claim 1 wherein the power module includes a printed circuit board that includes circuit traces on an electrically insulating film and a thermal layer that is mated to the film.

14. The system of claim 13 wherein the thermal layer is formed of at least one of aluminum and copper.

15. The system of claim 14 further comprising a thermal mass that draws heat from the thermal layer.

16. The system of claim 15 wherein the thermal mass includes heat dissipating projections.

17. The system of claim 1 further comprising an optoisolator that generates the control signal in response to an input signal.

18. The system of claim 1 wherein the power module comprises a plurality of transistors arranged in parallel, each of the plurality of transistors including a control terminal driven by the gate drive signal.

19. The system of claim 1 wherein:

the power module comprises a switch including a first terminal and a second terminal;

the first terminal of the switch is connected to the first voltage; and

the bootstrap charge pump module generates the bootstrap voltage based on a load voltage sensed at the second terminal of the switch.

20. The system of claim 19 further comprising a bootstrap capacitor, wherein:

the bootstrap capacitor includes a first terminal and a second terminal;

the second terminal of the bootstrap capacitor is connected to the second terminal of the switch; and

the bootstrap charge pump module generates the bootstrap voltage by charging the bootstrap capacitor via the first terminal of the bootstrap capacitor.

Assignments (10)
ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Oct 7, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS RETIRING AGENT
To: ANTARES CAPITAL LP, AS SUCCESSOR AGENT
Reel/Frame 036807/0592 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: PHILLIPS & TEMRO INDUSTRIES INC.
Reel/Frame 035161/0306 →
SECURITY INTEREST Recorded Mar 12, 2015
From: PHILLIPS & TEMRO INDUSTRIES INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 035152/0284 →
RELEASE OF SECURITY INTERESTS Recorded Oct 18, 2013
From: CHASE CAPITAL CORPORATION
To: PHILLIPS & TEMRO INDUSTRIES INC.; PHILTEM HOLDINGS, INC.
Reel/Frame 031435/0830 →
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2012
From: JPMORGAN CHASE BANK, N.A.
To: PHILLIPS & TEMRO INDUSTRIES, INC.
Reel/Frame 027697/0367 →
SECURITY AGREEMENT Recorded Feb 10, 2012
From: PHILLIPS & TEMRO INDUSTRIES INC.; PHILTEM HOLDINGS, INC.
To: CHASE CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 027683/0874 →
SECURITY AGREEMENT Recorded Feb 9, 2012
From: PHILLIPS & TEMRO INDUSTRIES INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 027683/0204 →
SECURITY AGREEMENT Recorded Nov 10, 2010
From: PHILLIPS & TEMRO INDUSTRIES INC.
To: CHASE CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT
Reel/Frame 025340/0949 →
SECURITY AGREEMENT Recorded Nov 3, 2010
From: PHILLIPS & TEMRO INDUSTRIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 025238/0067 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2006
From: SEGER, RONALD NEIL
To: PHILLIPS & TEMRO INDUSTRIES INC.
Reel/Frame 018359/0336 →