Interposer with compliant pins
An electrical interposer including first and second surfaces is provided. A plurality of compliant pins are connected to the first surface of the substrate, each of the compliant pins having a drawn body with at least one side wall extending along a longitudinal axis thereof substantially perpendicular to the substrate. A plurality of contact elements are connected to the substrate for making electrical contact with a device facing the second surface of the substrate. Electrical paths connect the compliant pins to the contact elements.
1. A method for making an interposer comprising:
providing a substrate;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies; and
providing an array of contact elements, having resilient elastic portions, on a second surface of the substrate.
2. A method for making an interposer comprising:
providing a substrate;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies;
providing a second conductive material sheet including an array of contact elements having resilient elastic portions; and
attaching the second conductive material sheet to a second surface of the substrate and singulating at least one of the contact elements.
3. A method for making an interposer comprising:
providing a substrate;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies;
etching and stamping a second conductive material sheet to form an array of contact elements having resilient elastic portions; and
attaching the second conductive material sheet to a second surface of the substrate and singulating at least one of the contact elements.
4. A method for making an interposer comprising:
providing a substrate;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
creating a longitudinal opening in a portion of at least one side wall of at least one of the plurality of pin-shaped bodies to form a compliant pin;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies; and
providing an array of contact elements, having resilient elastic portions, on a second surface of the substrate.
5. A method for making an interposer comprising:
providing a substrate;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies;
providing an array of contact elements, having resilient elastic portions, on a second surface of the substrate; and
providing the substrate with vias to electrically connect at least some of the pin-shaped bodies with at least some of the contact elements.
6. A method for making an interposer comprising:
providing a substrate including a PCB;
deep drawing a first conductive material sheet to form a plurality of pin-shaped bodies, each having at least one side wall;
attaching the first conductive material sheet to a first surface of the substrate;
singulating at least one of the plurality of pin-shaped bodies; and
providing an array of contact elements, having resilient elastic portions, on a second surface of the substrate.