Printhead assembly with ink distribution assembly

1. A printhead assembly that comprises

at least one elongate, printhead integrated circuit having a plurality of micro-electromechanical ink ejection mechanisms configured to eject ink;

an ink distribution assembly to which the, or each, printhead integrated circuit can be mounted and defining a plurality of converging ink passages in fluid communication with respective ink ejection mechanisms; and

an ink reservoir mounted to the ink distribution assembly and defining a plurality of parallel ink channels in fluid communication with respective groups of the passages, such that inks can be fed from the channels to respective groups of the ink ejection mechanisms,

wherein the ink distribution assembly is a laminated stack comprised of a plurality of layers that define openings and inwardly converging channels so that when laminated, the converging ink passages are defined, with the, or each, printhead integrated circuit being centrally positioned to be fed with ink from the converging ink passages.

2. A printhead assembly as claimed in claim 1 , which includes a plurality of printhead integrated circuits mounted to the ink distribution assembly in a staggered, overlapping manner.

3. A printhead assembly as claimed in claim 2 , in which the printhead integrated circuits are located in recesses defined by an end layer of the laminated stack.

4. A printhead assembly as claimed in claim 1 , further including a cover for mounting to the ink reservoir and defining a plurality of ink inlets in fluid communication with respective ink channels.

5. A printhead assembly as claimed in claim 4 , further including a printed circuit board bearing electronic components configured to drive the printhead integrated circuits and positioned on the cover.

6. A printhead assembly as claimed in claim 5 , in which TAB films interconnect the printed circuit board and the printhead integrated circuits.