IP Library Granted Patent US 7,477,115
Granted Patent B2
US 7,477,115 · App. 11/488,148 · Granted Jan 13, 2009

Piezoelectric resonator, method of manufacturing piezoelectric resonator, and filter, duplexer, and communication device using piezoelectric resonator

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Quick Facts
Patent No.
US 7,477,115
App. No.
11/488,148
Granted
Jan 13, 2009
Kind
B2
Abstract

A piezoeletric resonator includes: a substrate; a lower electrode formed on or above the substrate; a piezoeletric body formed on or above the lower electrode; an upper electrode formed on or above the piezoeletric body; and a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode. Where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr, an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr), a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8.

Claims (50)

1. A piezoeletric resonator, comprising:

a substrate;

a lower electrode formed on or above the substrate;

a piezoeletric body formed on or above the lower electrode;

an upper electrode formed on or above the piezoeletric body; and

a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode, the cavity having a trapezoidal shape in section, wherein

where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr,

an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and

a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr),

a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8, where n is an integer.

2. The piezoeletric resonator according to claim 1 , wherein the depth of the cavity is set as n×λc/2.

3. The piezoeletric resonator according to claim 1 , wherein

when the piezoeletric resonator is used to form a band-pass filter,

the depth of the cavity is determined so that no spurious resonant frequency is present within a frequency range of a half of a desired pass-bandwidth of the band-pass filter.

4. The piezoeletric resonator according to claim 3 , wherein

when the band-pass filter is used for Personal Communications Services (PCS),

the depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/10 and equal to or smaller than n×λc/2+λc/10.

5. A filter including a plurality of piezoeletric resonators, wherein

at least one of the piezoeletric resonators includes:

a substrate;

a lower electrode formed on or above the substrate;

a piezoeletric body formed on or above the lower electrode;

an upper electrode formed on or above the piezoeletric body; and

a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode, the cavity having a trapezoidal shape in section and

where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr,

an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and

a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr),

a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8, where n is an integer.

6. A duplexer formed by a filter including a plurality of piezoeletric resonators, wherein

at least one of the piezoeletric resonators includes:

a substrate;

a lower electrode formed on or above the substrate;

a piezoeletric body formed on or above the lower electrode;

an upper electrode formed on or above the piezoeletric body; and

a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode, the cavity has a trapezoidal shape in section and

where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr,

an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and

a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr),

a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8, where n is an integer.

7. A communication device including a piezoeletric resonator, wherein

the piezoeletric resonator includes:

a substrate;

a lower electrode formed on or above the substrate;

a piezoeletric body formed on or above the lower electrode;

an upper electrode formed on or above the piezoeletric body; and

a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode, the cavity has a trapezoidal shape in section and

where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr,

an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and

a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr),

a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8, where n is an integer.

Assignments (2)
CHANGE OF NAME Recorded Nov 19, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021858/0958 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2006
From: NAKATSUKA, HIROSHI; ONISHI, KEIJI; NAKAMURA, HIROYUKI; YAMAKAWA, TAKEHIKO; YAMAGUCHI, HIROSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018219/0921 →