Method of manufacture of an identification wristband construction
View Patent ↗A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at predetermined areas on the bottom substrate. A remainder of the circuit is deposited on the bottom substrate and dielectric materials. A transponder chip is secured to the bottom substrate to form a transponder. A second substrate is affixed to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and second substrate.
1. A method of manufacture of a wristband comprising the steps of:
providing a bottom substrate;
depositing first circuit elements on the bottom substrate;
curing the first circuit elements;
depositing a dielectric material on at least one predetermined area on the bottom substrate and of the cured first circuit elements;
depositing a remainder of the circuit on the bottom substrate and dielectric material;
securing an RFID integrated circuit chip to the bottom substrate to form a transponder with the first circuit elements and the remainder of the circuit; and
affixing a top substrate to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and top substrate.
2. The method of claim 1 , further comprising the step of pre-treating the bottom substrate to prevent warping or shrinkage during manufacture.
3. The method of manufacture of claim 1 , wherein the first circuit elements are deposited on the bottom substrate by printing a pattern with conductive ink.
4. The method of claim 3 , wherein the first circuit elements include elements of an antenna and a disabling wire.
5. The method of manufacture of claim 1 , further comprising the step of curing the dielectric material.
6. The method of manufacture of claim 1 , wherein said dielectric material forms a bridge for portions of the transponder.
7. The method of manufacture of claim 1 , wherein the chip is secured to the bottom substrate by use of one of conductive adhesive, anisotropic conductive adhesive, non-conductive paste, or solder.
8. The method of manufacture of claim 1 , wherein the second substrate is fixed to the bottom substrate utilizing a pressure sensitive adhesive.
9. The method of manufacture of claim 1 , further comprising the step of installing a snap insert to the bottom and second substrate, and installing a snap retainer in the bottom and second substrate.
10. The method of manufacture of claim 1 , further comprising the step of providing stiffeners at preselected portions at either one of said bottom or top substrates.
11. The method of manufacture of claim 10 wherein the stiffener is provided at a position overlying at least one of the transponder chip or dielectric material.
12. The method of manufacture of claim 1 wherein affixing a top substrate to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and top substrate comprises affixing a top substrate that is substantially thicker than the bottom substrate.