High power and high brightness diode-laser array for material processing applications
View Patent ↗Arrangements for combination and fast-axis alignment of fast-axes of diode-laser beams are disclosed. Alignment arrangements include providing each diode-laser with a corresponding alignable fast-axis collimating lens, providing individually alignable mirrors for steering an re-orienting beams from each diode-laser, and providing single diode-laser slab-modules in which the diode-laser beams can be pre-aligned to a common propagation-axis direction, and in which edges and surfaces of the slabs can be used to align the fast and slow-axes of the beams. Beam combination methods include combination by dichroic elements, polarization-sensitive elements, and optical fiber bundles.
1. A diode-laser module, comprising:
a metal heat-sink having first and second opposite surfaces parallel to each other and an edge and a thickness;
the heat-sink having cut-out region in the edge thereof, with the cutout region arranged to form first and second open-sided recesses in the respectively the first and second surfaces of the heat sink, with each recess having a depth less than the thickness of the heat-sink and wherein each recess has a width extending parallel to said edge and wherein the width of the first recess is less than the width of the second recess;
a thermally conductive, electrically insulating sub-mount having first and second opposite surfaces, the sub-mount being bonded to the heat-sink in the second recess such that the first surface of the sub-mount faces into the first recess of the heat-sink and the second surface of the sub-mount faces into the second recess of the heat-sink; and
a diode-laser bonded to the first surface of the sub-mount in the first recess of the heat sink and arranged to emit a diode-laser beam from the module via the open side of the first recess.
2. The module of claim 1 , wherein the first and second recesses have respectively first and second depths the sum of the first and second depths being equal to the thickness of the heat-sink.
3. The module of claim 2 , wherein the diode-laser has a thickness less than the depth of the first recess in the heat-sink and the sub-mount has a thickness less than the depth of the second recess in the heat-sink.
4. A diode-laser array, comprising:
a plurality of diode-laser modules each including a diode-laser;
each of the diode-laser modules including a metal heat-sink having first and second opposite surfaces parallel to each other and an edge and a thickness, the heat-sink having cut-out region in the edge thereof, with the cutout region arranged to form first and second open-sided recesses in the respectively the first and second surfaces of the heat sink, with each recess having a depth less than the thickness of the heat-sink and wherein each recess has a width extending parallel to said edge and wherein the width of the first recess is less than the width of the second recess;
each of the diode-laser modules including a thermally conductive, electrically insulating sub-mount having first and second opposite surfaces, the sub-mount being bonded to the heat-sink in the second recess such that the first surface of the sub-mount faces into the first recess of the heat-sink and the second surface of the sub-mount faces into the second recess of the heat-sink, the diode-laser being bonded to the first surface of the sub-mount in the first recess of the heat sink and arranged to emit a diode-laser beam from the module via the open side of the first recess; and
wherein the diode-laser modules are stacked with the second surface of one heat sink in thermal communication with the first surface of an adjacent heat sink and with fast-axes of the diode-lasers aligned in the fast-axis direction.
5. The diode-laser array of claim 4 , wherein each diode-laser module includes a cylindrical lens arranged to collimate the beam from the diode-laser in the fast-axis thereof.
6. The diode-laser of claim 5 , wherein the beams from the diode-lasers propagate about parallel to each other.