Module with embedded electronic components
View Patent ↗In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.
1. A module with embedded electronic components comprising:
a substrate;
a plurality of electronic components each of which is mounted on the substrate and is at least one of a resistor, a capacitor, and a coil; and
an encapsulating resin in which the electronic components are encapsulated, wherein
connection electrodes connected to the electronic components are formed on a component mounting surface of the substrate on which the electrode components are mounted,
each of the electronic components comprises two electrode portions fixed to the individual connection electrodes each by using a solder and a main body portion interposed between the two electrode portions,
when a distance between the component mounting surface and a lower surface of the main body portion is assumed to be a and a thickness of the portion of the encapsulating resin which is located above the main body portion is assumed to be b, b/a is not more than 6, and
a thickness of the portion of the encapsulating resin which is located above the component mounting surface is not less than 400 μm and not more than 600 μm.
2. The module with embedded electronic components of claim 1 , wherein the b/a is not more than 5.
3. The module with embedded electronic components of claim 1 , wherein the b/a is not more than 4.
4. The module with embedded electronic components of claim 1 , wherein the b/a is not more than 3.
5. The module with embedded electronic components of claim 1 , wherein the a is not less than 30 μm and not more than 60 μm.
6. The module with embedded electronic components of claim 1 , wherein a thickness of the substrate is not less than 500 μm and not more than 700 μm.
7. The module with embedded electronic components of claim 1 , wherein the b is not less than 100 μm and not more than 200 μm.
8. The module with embedded electronic components of claim 1 , wherein the substrate is an organic substrate.
9. The module with embedded electronic components of claim 1 , wherein the substrate is a ceramic substrate.
10. A module with embedded electronic components comprising:
a substrate;
a plurality of electronic components each of which is mounted on the substrate and is at least one of a resistor, a capacitor, and a coil; and
an encapsulating resin in which the electronic components are encapsulated, wherein
connection electrodes connected to the electronic components are formed on a component mounting surface of the substrate on which the electrode components are mounted,
each of the electronic components comprises two electrode portions fixed to the individual connection electrodes each by using a solder and a main body portion interposed between the two electrode portions,
a thickness of the portion of the encapsulating resin which is located above the component mounting surface is not less than 400 μm and not more than 600 μm, and
a distance between the component mounting surface and a lower surface of the main body portion is not less than 30 μm and not more than 60 μm
11. The module with embedded electronic components of claim 10 , wherein a thickness of the substrate is not less than 500 μm and not more than 700 μm.