IP Library Granted Patent US 7,702,226
Granted Patent B1
US 7,702,226 · App. 11/490,196 · Granted Apr 20, 2010

Board mounted hermetically sealed optical device enclosure and manufacturing methods therefor

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Quick Facts
Patent No.
US 7,702,226
App. No.
11/490,196
Granted
Apr 20, 2010
Kind
B1
Abstract

An apparatus includes a planar member having a first planar surface, a hollow body having first and second end openings, and a window. The planar member is configured to receive a device mounted on the first planar surface and surrounded by at least a track of a first material having a first hardness affixed to the first planar surface. The hollow body has a sharp edge at the second end along a planar section of the hollow body. The hollow body comprises a second material with a second hardness equal to or greater than the first hardness. The window encloses the hollow body first end forming an enclosure interior region configured to surround the device. The window provides the transmission of light into or out of the interior region. The hollow body second end is urged against the first material to form a hermetically sealed enclosure around the device.

Claims (21)

1. A camera enclosure apparatus, comprising:

a component board having a planar surface;

a camera mounted on the planar surface;

a hollow body comprising one or more walls substantially perpendicular to the component board, an opening on a first end of the hollow body, and an opening on a second end of the hollow body, wherein the one or more walls taper to a sharp edge at a furthermost edge of the second end along a planar section of the hollow body; and

a window enclosing the hollow body first end to provide a partial enclosure that is open at the hollow body second end, the partial enclosure having an interior region configured to surround the camera mounted on the planar surface, the window being configured to provide the transmission of light into the interior region and to the camera, the hollow body second end being configured for urging against the planar surface to press into the planar surface to secure the hollow body to the component board to form a hermetic seal around the camera.

2. The camera enclosure of claim 1 ,

wherein the hollow member material includes metal and comprises an electromagnetic interference (EMI) shield, and

wherein the hollow member has one of a substantially circular or polygonal cross section, and

wherein the planar surface material includes ceramic and at least a track of a soft metal surrounding the camera that may be deformed by the urging of the hollow body second end against the planar surface.

3. The camera enclosure of claim 1 , wherein the window material is selected from the group consisting of glass, quartz, and crystal.

4. An apparatus, comprising:

a camera;

a component board having a first planar surface, the component board being configured to receive the camera mounted on the first planar surface and surrounded by at least a track of a first material affixed to the first planar surface, the first material having a first hardness;

a hollow body member comprising one or more walls substantially perpendicular to the component board, an opening on a first end of the hollow body, and an opening on a second end of the hollow body, wherein the one or more walls taper to a sharp edge along a planar section at a furthermost edge of the second end of the hollow body, the hollow body comprising a second material with a second hardness, the second hardness being equal to or greater than the first hardness; and

a window member enclosing the hollow body first end to provide, a partial enclosure having an enclosed interior region configured to surround the camera, the window providing the transmission of light at least one of into or out of the interior region, the hollow body second end being urged against the first material on the component board to press into the track to secure the hollow body to the component board to form a hermetically sealed enclosure around the camera.

5. The apparatus of claim 4 , wherein the hollow body has a circular cross section.

6. The apparatus of claim 4 , wherein the hollow body has a polygonal cross section.

7. The apparatus of claim 4 , wherein the first material and the second material are the same material with the same hardness.

8. The apparatus of claim 4 , wherein the window is a substantially transparent member selected from the group consisting of a window having substantially parallel and substantially planar surfaces, a prism having substantially planar non-parallel surfaces, and a lens having at least one curved non-planar surface.

9. The apparatus of claim 4 , wherein the hermetically sealed enclosure around the camera contains an inert gas selected from the group consisting of argon, helium, neon, and xenon.

10. The apparatus of claim 4 , wherein the hermetically sealed enclosure interior region around the camera is evacuated.

Assignments (9)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
CHANGE OF NAME Recorded Aug 23, 2011
From: TESSERA MEMS TECHNOLOGIES, INC.
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 026794/0897 →
CHANGE OF NAME Recorded Sep 24, 2010
From: SIIMPEL CORPORATION
To: TESSERA MEMS TECHNOLOGIES, INC.
Reel/Frame 025039/0071 →
RELEASE OF SECURITY INTEREST Recorded May 7, 2010
From: SCALE VENTURE PARTNERS II, L.P.
To: SIIMPEL CORPORATION
Reel/Frame 024351/0353 →
PATENT SECURITY AGREEMENT Recorded Mar 31, 2010
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P.
Reel/Frame 024170/0078 →
PATENT SECURITY AGREEMENT Recorded Nov 16, 2009
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P., AS COLLATERAL AGENT
Reel/Frame 023519/0715 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2006
From: GUTIERREZ, ROMAN C.
To: SIIMPEL CORPORATION
Reel/Frame 018340/0597 →