Stacked semiconductor module
View Patent ↗A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.
1. A stacked semiconductor module,
wherein the module is made by stacking a second semiconductor device above a first semiconductor device, the second semiconductor device having a second semiconductor chip mounted to a top surface of a second semiconductor substrate, the first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate,
a top surface of the first semiconductor substrate is provided with a first connection terminal,
a bottom surface of the second semiconductor substrate is provided with a second connection terminal,
a first conductive connecting member connects the first connection terminal to the second connection terminal,
an underfill resin fills between the second semiconductor substrate and the second semiconductor chip, and
said stacked semiconductor module is arrange such that a first outer periphery of a first region in which the underfill resin is formed surrounds, in plan view, a second outer periphery of a second region in which the second semiconductor chip is held, thereby forming a middle region between said first and second outer periphery,
wherein at least a portion of said first conductive connecting member is formed, in plan view, in said middle region.
2. The module of claim 1 , wherein the first semiconductor chip is mounted to a center portion of the first semiconductor substrate.
3. The module of claim 1 , wherein a region where the second semiconductor chip is mounted is larger than a region where the first semiconductor chip is mounted.
4. The module of claim 1 , wherein the second semiconductor chip is composed of a plurality of semiconductor chips arranged on the same plane.
5. The module of claim 1 , wherein the second semiconductor chip is composed of a plurality of semiconductor chips in a stacked arrangement.
6. The module of claim 1 , wherein the first conductive connecting member is formed in a region under the second semiconductor chip.
7. The module of claim 1 , further comprising a second conductive connecting member formed, in plan view, inside the second region.
8. The module of claim 1 , further comprising a plurality of said first conductive connecting members and a plurality of second conductive connecting member, each of said plurality of first and second conductive connecting members are formed, in plan view, inside the first region.
9. The module of claim 1 , further comprising a substrate interconnect formed in and/or on the first semiconductor substrate and/or the second semiconductor substrate.