Process for manufacture of ceramic capacitors using ink jet printing
A process for forming a multilayer ceramic device. The device includes forming a ceramic precursor layer followed by ink jet printing in alternating order an electrode precursor in a predetermined pattern on the ceramic precursor layer to form an electrode and a ceramic ink on the electrode. The ceramic precursor is then sintered.
1 . A process for forming a multilayer ceramic device comprising:
forming a ceramic precursor layer;
ink jet printing in alternating order an electrode precursor in a predetermined pattern on said ceramic precursor layer to form an electrode and a ceramic ink on said electrode; and
sintering said ceramic precursor.
2 . The process for forming a multilayer ceramic device of claim 1 further comprising ink jet printing terminations in electrical contact with alternating electrodes.
3 . The process for forming a multilayer ceramic device of claim 2 wherein said ink jet printing terminations is done in a printing pass with said ink jet printing an electrode precursor.
4 . The process for forming a multilayer ceramic device of claim 1 wherein said ceramic ink is in contact with a previous ceramic ink.
5 . The process for forming a multilayer ceramic device of claim 1 wherein each said electrode is continuous.
6 . The process for forming a multilayer ceramic device of claim 1 wherein at least one said electrode comprises voids.
7 . The process for forming a multilayer ceramic device of claim 1 wherein more than one said electrode is interconnected by an electrically conducting via.
8 . The process for forming a multilayer ceramic device of claim 1 wherein at least one said electrode is connected to the exterior of the device by an electrically conducting via.
9 . The process for forming a multilayer ceramic device of claim 1 wherein more than one said electrode is interconnected by a thermally conducting via.
10 . The process for forming a multilayer ceramic device of claim 1 wherein at least one said electrode is connected to the exterior of the device by a thermally conducting via.
11 . The process for forming a multilayer ceramic device of claim 1 wherein more than one said electrode is interconnected by a resistor, inductor or semiconductor via.
12 . The process for forming a multilayer ceramic device of claim 1 wherein at least one said electrode is connected to the exterior of the device by a resistor, inductor, or semiconductor via.
13 . The process for forming a multilayer ceramic device of claim 1 wherein at least one said electrode is patterned.
14 . The process for forming a multilayer ceramic device of claim 13 wherein at least one said electrode is serpentine.
15 . A capacitor formed by the method of claim 1 .
16 . A process for forming a multilayer ceramic capacitor comprising:
a) depositing a ceramic precursor on a support;
b) ink jet printing an electrode precursor in a first predetermined pattern on said ceramic precursor;
c) ink jet printing a second ceramic precursor in a second predetermined pattern on said electrode layer;
d) repeating b) and c) until a predetermined number of layers is obtained;
e) removing said support; and
f) sintering said ceramic precursor.
17 . The process for forming a multilayer ceramic device of claim 16 further comprising ink jet printing terminations in electrical contact with alternating electrodes.
18 . The process for forming a multilayer ceramic device of claim 16 wherein said ink jet printing terminations is done in a printing pass with said ink jet printing an electrode precursor.
19 . The process for forming a multilayer ceramic device of claim 16 wherein said ceramic ink is in contact with a previous ceramic ink.
20 . The process for forming a multilayer ceramic device of claim 16 wherein each said electrode is continuous.
21 . The process for forming a multilayer ceramic device of claim 16 wherein at least one said electrode comprises voids.
22 . The process for forming a multilayer ceramic device of claim 16 wherein at least one said electrode is patterned.
23 . The process for forming a multilayer ceramic device of claim 16 wherein more than one said electrode is interconnected by a thermally conducting via.
24 . The process for forming a multilayer ceramic device of claim 16 wherein at least one said electrode is connected to the exterior of the device by a thermally conducting via.
25 . The process for forming a multilayer ceramic device of claim 16 wherein more than one said electrode is interconnected by a resistor, inductor or semiconductor via.
26 . The process for forming a multilayer ceramic device of claim 16 wherein at least one said electrode is connected to the exterior of the device by a resistor, inductor, or semiconductor via.
27 . The process for forming a multilayer ceramic device of claim 16 wherein at least one said electrode is serpentine.
28 . A capacitor formed by the process of claim 16 .
29 . A process for forming a multilayer ceramic capacitor comprising:
forming a ceramic precursor layer;
ink jet printing an electrode ink on said ceramic precursor layer to form a first electrode layer;
ink jet printing a ceramic precursor ink on said first electrode layer to form a first dielectric layer;
ink jet printing an electrode ink on said first dielectric layer and beyond an edge of said first dielectric layer to be in electrical contact with said first electrode layer thereby forming a second electrode layer;
ink jet printing a ceramic precursor ink on said second electrode layer and beyond an edge of said second electrode layer to contact said first dielectric layer.
30 . The process for forming a multilayer ceramic device of claim 29 further comprising ink jet printing terminations in electrical contact with alternating electrodes.
31 . The process for forming a multilayer ceramic device of claim 30 wherein said ink jet printing terminations is done in a printing pass with said ink jet printing an electrode precursor.
32 . The process for forming a multilayer ceramic device of claim 29 wherein said ceramic ink is in contact with a previous ceramic ink.
33 . The process for forming a multilayer ceramic device of claim 29 wherein each said electrode is continuous.
34 . The process for forming a multilayer ceramic device of claim 29 wherein at least one said electrode comprises voids.
35 . The process for forming a multilayer ceramic device of claim 29 wherein at least one said electrode is patterned.
36 . The process for forming a multilayer ceramic device of claim 29 wherein more than one said electrode is interconnected by a thermally conducting via.
37 . The process for forming a multilayer ceramic device of claim 29 wherein at least one said electrode is connected to the exterior of the device by a thermally conducting via.
38 . The process for forming a multilayer ceramic device of claim 29 wherein more than one said electrode is interconnected by a resistor, inductor or semiconductor via.
39 . The process for forming a multilayer ceramic device of claim 29 wherein at least one said electrode is connected to the exterior of the device by a resistor, inductor, or semiconductor via.
40 . The process for forming a multilayer ceramic device of claim 29 wherein at least one said electrode is serpentine.
41 . A capacitor formed by the method of claim 29 .