Printed circuit wiring board and electronic apparatus
View Patent ↗According to one embodiment, a printed circuit wiring board includes: a substrate having a conductor pattern thereon; a flexible flat cable including a connection section; and a connector including a contact section, a fitting port section and a housing. The contact section includes a first area and a second area provided on the first area. The first area contains copper. The second area has a surface containing tin and copper. The fitting port section is fitted to the connection section to connect with the contact section. The flexible flat cable includes a pair of insulating sheets and a plurality of conductors arranged therebetween. The conductors contain tin and copper and have the connection section on end portions. The connection section includes a first region and a second region provided on the first region. The first region contains copper. The second region has a surface containing tin and copper.
1. A printed circuit wiring board comprising:
a substrate;
a conductor pattern on the substrate;
a flexible flat cable comprising a connection section; and
a connector provided on the substrate, the connector comprising a contact section, a fitting port section and a housing configured to retain the connecting section of the flexible flat cable, the contact section comprising a first region comprising copper and a second region formed on the first region, at least a portion of a surface of the second region comprising tin and copper from a tin-copper alloy,
wherein the contact section is obtained by annealing a copper main body and a tin layer plated on the copper main body until a tin-copper alloy phase existing on a copper phase reaches to at least the part of the surface region of the second region and the contact section is made by substantially annealing at a temperature from about 220° C. to about 400° C.; and
the connection section is obtained by annealing a copper main body and a tin layer plated on the copper main body until a tin-copper alloy phase existing on a copper phase reaches to at least the part of the surface region of the second region and the connection section is made by substantially annealing, at a temperature from about 220° C. to about 300° C.
2. An electronic device comprising the printed circuit board of claim 1 .
3. The electronic device of claim 2 , wherein the electronic device is located within a computing device.