Semiconductor device mounting chip having tracing function
View Patent ↗A trace chip monitors a signal between a target logic chip having a data processing circuit mounted thereon and a memory chip having a memory storing data to be used by the target logic chip mounted therein, and traces an operation of the target logic chip. As the trace chip is implemented by a chip separate from the target logic chip and a memory chip, a debugging circuit need not be added to mass-produced articles when the trace chip is not mounted to the mass-produced articles. Thus, manufacturing cost of the articles can be reduced.
1. A semiconductor device comprising:
a first chip as an object of tracing and having a data processing circuit mounted thereon;
a second chip having a storage circuit storing data used by said first chip mounted thereon; and
a third chip monitoring a signal between said first chip and said second chip and tracing an operation of said first chip, and formed by a chip separate from said first and second chips, wherein said third chip is connected directly to at least one of the first and second chips;
wherein said semiconductor device is a stacked type multichip package having said first, second and third chips mounted in a height direction;
wherein said third chip includes
a sample pad inserted between a wiring between said first and second chips,
a trace circuit monitoring a signal flowing through the sample pad and controlling tracing of said first chip,
a first storage circuit successively storing the signal flowing through the sample pad as trace information, and
an external input/output port externally outputting the trace information stored in said first storage circuit and externally receiving data as an input for setting of said trace circuit; and
wherein said trace circuit includes
a trace point register storing a memory address to be monitored,
a comparing circuit comparing an address flowing through said sample pad with the memory address stored in said trace point register, and
a control circuit controlling progress of tracing based on a result of comparison by said comparing circuit.
2. The semiconductor device according to claim 1 , wherein connection of said first, second and third chips is made by wire bonding.
3. The semiconductor device according to claim 1 , wherein at least part of connection of said first, second and third chips is made by flip chip connection.
4. The semiconductor device according to claim 1 , wherein said trace circuit includes a second storage circuit storing a program for controlling tracing, and a microcontroller controlling tracing by monitoring the signal flowing through said sample pad, in accordance with the program stored in said second storage circuit.
5. The semiconductor device according to claim 1 , wherein said trace circuit includes a reconfigurable device having a circuitry reconfigurable by external information, for controlling tracing by monitoring the signal flowing through said sample pad.
6. The semiconductor device according to claim 1 , wherein said third chip further includes a high speed I/O externally outputting trace information storage in said first storage circuit at high speed.
7. The semiconductor device according to claim 1 , wherein said third chip further includes an USB interface externally outputting trace information stored in said first storage circuit.
8. The semiconductor device according to claim 1 , wherein said third chip further includes a USB host function externally outputting trace information stored in said first storage circuit.
9. The semiconductor device according to claim 1 , wherein said sample pad includes a first pad connected to said first chip by a wire, a second pad connected to said second chip by a wire, and a driver connected between said first and second pads.
10. A semiconductor device comprising:
a first chip as an object of tracing and having a data processing circuit mounted thereon;
a second chip having a storage circuit storing data used by said first chip mounted thereon; and
a third chip monitoring a signal between said first chip and said second chip and tracing an operation of said first chip, and formed by a chip separate from said first and second chips, wherein said third chip is connected directly to at least one of the first and second chips;
wherein said semiconductor device is a plane type multichip package having said first, second and third chips mounted in a horizontal direction;
wherein said third chip includes
a sample pad inserted between a wiring between said first and second chips,
a trace circuit monitoring a signal flowing through the sample pad and controlling tracing of said first chip,
a first storage circuit successively storing the signal flowing through the sample pad as trace information, and
an external input/output port externally outputting the trace information stored in said first storage circuit and externally receiving data as an input for setting of said trace circuit; and
wherein said trace circuit includes
a trace point register storing a memory address to be monitored,
a comparing circuit comparing an address flowing through said sample pad with the memory address stored in said trace point register, and
a control circuit controlling progress of tracing based on a result of comparison by said comparing circuit.