IP Library Granted Patent US 7,595,829
Granted Patent B2
US 7,595,829 · App. 11/494,727 · Granted Sep 29, 2009

Solid-state image pickup device

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Quick Facts
Patent No.
US 7,595,829
App. No.
11/494,727
Granted
Sep 29, 2009
Kind
B2
Abstract

There provided are a layout configuration in which fluctuation in pixel sensitivity characteristics is reduced and a solid-state image pickup device which attains high yield and high sensitivity. Respective sections included in pixels 2 a and 2 b , such as light receiving regions 20 a and 20 b of PDs 3 a and 3 b , transfer gate electrodes 4 a and 4 b , and FD 5 , have outer shapes comprising lines extending in row directions and lines extending in column directions. The light receiving regions 20 a and 20 b , the transfer gate electrodes 4 a and 4 b , and FD 5 which the pixel pair includes are disposed in an axisymmetrical manner with respect to a straight line extending between the 2 pixels of the pixel pair. And FD 5 and source regions and drain regions of a reset transistor 6 and an amplifier transistor 12 are disposed in a straight line extending in a column direction.

Claims (19)

1. A solid-state image pickup device, comprising:

a plurality of pixels, each of which includes a photodiode and a transfer gate electrode for transferring a charge accumulated in the photodiode and which are disposed in a pixel region of a surface of a semiconductor substrate;

a plurality of floating diffusions, each of which is provided for a pixel pair including two pixels adjacent in a column direction;

a plurality of MOS-type amplifier transistors, respectively having gate electrodes respectively connected to the floating diffusions; and

a plurality of first wirings, each of which connects the transfer gate electrodes of two pixels adjacent in a row direction, wherein:

light receiving regions of the photodiodes, the transfer gate electrodes, the floating diffusions have outer shapes consisting of lines extending in row directions and lines extending in column directions and are disposed in an axisymmetrical manner with respect to a straight line extending between a pair of the photodiodes included in the pixel pair, and

the first wiring connecting the transfer gate electrodes of the two pixels adjacent in the row direction is unified with the transfer gate electrodes.

2. The solid-state image pickup device according to claim 1 , wherein:

the light receiving region, the transfer gate electrode, and the floating diffusion have rectangular shapes whose long sides are straight lines extending in column directions; and

the long side of the floating diffusion is approximately twice or more as long as a shorter side thereof.

3. The solid-state image pickup device according to claim 1 , wherein the first wiring includes:

a first part which extends in a row direction between the light receiving regions of the pixel pair and is connected to one end of the transfer gate electrode of the pixel; and

a second part which extends along a part of an exterior edge of the floating diffusion and is connected to another end of the transfer gate electrode of the pixel and to a first part provided in the pixel adjacent in the row direction.

4. The solid-state image pickup device according to claim 1 , further comprising a plurality of MOS-type reset transistors, each of which is provided in the each pixel pair and connects the floating diffusion at a reference potential, wherein

a source region and a drain region of the amplifier transistor, a source region and a drain region of the reset transistor, and the floating diffusion are disposed in a straight line extending in a column direction.

5. The solid-state image pickup device according to claim 4 , further comprising a plurality of second wirings, each of which connects gate electrodes of the reset transistors of two pixels adjacent in a row direction, wherein

the second wiring connecting the gate electrodes and the gate electrode of the reset transistor provided in the pixel pair are disposed on a straight line extending in a row direction between the pixel pair and a pixel pair adjacent in a column direction.

6. The solid-state image pickup device according to claim 5 , wherein the second wiring connecting the gate electrodes of the reset transistors is unified with the gate electrodes.

7. The solid-state image pickup device according to claim 1 , wherein directions from the photo diodes of the pixel pair to the floating diffusion are substantially the same with each other.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →
LIEN Recorded Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
CHANGE OF NAME Recorded Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2007
From: OHTA, SOUGO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019250/0529 →